EPM570GM256C5N - 440 Macrocell MAX II CPLD | Altera / Intel
N.º de pieza: EPM570GM256C5N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $26.8 | $26,80 |
| 10 | $24.5 | $245,00 |
| 25 | $23.2 | $580,00 |
| 100 | $21.4 | $2.140,00 |
| 250 | $19.75 | $4.937,50 |
| 500 | $18.6 | $9.300,00 |
EPM570GM256C5N Descripción general
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on, deterministic timing of traditional PAL/GAL architectures with the high logic density of modern FPGAs. Within the broader taxonomy, the EPM570 belongs to the hierarchy: macrocell -> logic array block (LAB) -> CPLD -> programmable logic device (PLD) -> digital IC -> semiconductor. MAX II devices are positioned as low-power, non-volatile glue-logic replacements for discrete MSI/SSI logic and small FPGAs.
Key features of the EPM570GM256C5N include 440 macrocells organized into 57 logic array blocks (LABs), 160 user I/O pins, a maximum internal operating frequency of 304 MHz (per distributor listings) with the published data sheet fMAX of 201.1 MHz, and the multiVolt I/O interface that allows the device to interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic without external level shifters. The C5 speed grade corresponds to a 5 ns pin-to-pin logic delay.
The MAX II architecture is built around a flash-based configuration memory that eliminates the external boot PROM required by SRAM-based FPGAs. This gives EPM570 designs instant-on behavior in less than 200 µs and deterministic power-on state, which is critical for system-level control, bus-interface, and power-sequencing logic. The 57 LAB structure provides wide fan-in control for decoding and state-machine applications.
Typical applications for the EPM570GM256C5N include I/O expansion and bus bridging in industrial controllers, glue-logic consolidation in telecom and networking line cards, state-machine and interface logic in medical instrumentation, motor-control timing in factory automation, and display-panel timing generation in consumer electronics. The 160-I/O count and 256-ball BGA package make it suitable for high-pin-count designs that exceed the capability of smaller TQFP-packaged MAX II devices.
When designing with the EPM570GM256C5N, the 11x11 mm Micro FineLine BGA package requires careful PCB layout: a 0.8 mm ball pitch demands NSMD (non-solder mask defined) pads with via-in-pad or microvia escape routing, and four PCB layers are recommended for clean power delivery. The 1.8 V core requires a local 0.1 µF + 1 µF decoupling pair per supply pin pair, and JTAG chain length should be validated for multi-device boards.
This page synthesizes distributor stock and pricing, drop-in pin-compatible alternatives, and practical BGA layout/design notes not found on a single datasheet page.
Alternativas directas para EPM570GM256C5N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPM570GM256C5N (mismo factor de forma y huella) — difiere en Operating Temperature, Process Technology, Package, Series, Lead-Free / RoHS.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPM570GF256C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$17.95 / unidad
Ver hoja de datos →EPM1270GM256C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EPM2210GM256C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EPM570GM100C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$10.4 / unidad
Ver hoja de datos →EPM570GM256C5N Valores máximos y características eléctricas
| Series | MAX II |
| Family | CPLD - Complex Programmable Logic Device |
| Macro Cells | 440 |
| Logic Array Blocks (LABs) | 57 |
| Number of I/Os | 160 |
| Maximum Operating Frequency | 304 MHz |
| Maximum Internal Frequency (datasheet fMAX) | 201.1 MHz |
| Pin-to-Pin Logic Delay (Speed Grade C5) | 5 ns |
| Operating Supply Voltage (Core VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) |
| I/O Bank Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) |
| Process Technology | 0.18 um flash-based CMOS |
| Programmable Type | In System Programmable (ISP) via JTAG |
| Encapsulado / Carcasa | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) |
| Estilo de montaje | SMD/SMT |
| Packaging | Tray |
| Lead Free / RoHS Status | See manufacturer page; legacy part - verify per lot |
| Configuration Memory | Internal flash (non-volatile, instant-on) |
| JTAG Support | Yes (IEEE 1149.1 / 1532) |
| Vertical Migration | Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package |
Guía de configuración de pines de EPM570GM256C5N 256-ball micro fineline bga, 11x11 mm, 0.8 mm pitch
Configuración de pines para EPM570GM256C5N (encapsulado 256-ball micro fineline bga, 11x11 mm, 0.8 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPM570GM256C5N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPM570GM256C5N es adecuado para 6 aplicacións: Industrial Control Glue Logic, Bus Bridging and Protocol Conversion, Telecom Line-Card Interface Logic, Motor-Control Timing and PWM Generation, Medical Instrumentation Glue Logic, Display Panel Timing Generator.
Industrial Control Glue Logic
The EPM570GM256C5N is well suited to industrial control boards as a glue-logic consolidator that replaces 5-10 discrete MSI/SSI packages with a single non-volatile device. Its 440 macrocells and 160 user I/Os comfortably handle address-latch, chip-select, bus-arbitration, and watchdog logic around a microcontroller or SoC. The instant-on flash-based configuration (under 200 µs) ensures deterministic power-up state for safety-critical interlocks, while the multiVolt I/O banks interface directly to 3.3 V MCUs and 5 V legacy peripherals. The 256-MBGA package keeps board area compact for DIN-rail PLC form factors.
Recomendado
Bus Bridging and Protocol Conversion
Designers use the EPM570GM256C5N as a flexible bus bridge between mismatched interfaces - for example, converting a parallel Local Bus to SPI/I2C, or implementing a custom memory-mapped register decoder. The 57 LAB structure delivers wide fan-in for address decoding, and the 5 ns pin-to-pin delay (C5 grade) keeps glue-logic latency low enough that the CPLD does not bottleneck the bus. Its 160 I/Os handle full 16-bit data + 24-bit address + control bus implementations in a single device. The MAX II flash memory stores the bridge configuration non-volatility, so power-cycling does not require re-programming.
Recomendado
Telecom Line-Card Interface Logic
In telecom line cards the EPM570GM256C5N implements TDM/timeslot switching, frame-alignment detection, and clock-domain crossing between the framer, mapper, and backplane SERDES. Its 1.8 V core plus multiVolt I/Os interface directly to 2.5 V and 3.3 V framers and to 1.5 V LVCMOS backplane logic without external level shifters, reducing BOM and board area. The JTAG (IEEE 1149.1/1532) interface supports in-system boundary-scan tests across the line-card population, simplifying manufacturing test and field diagnostics. The 256-ball Micro FineLine BGA fits the dense backplane real-estate typical of ATCA/AMC line cards.
Recomendado
Motor-Control Timing and PWM Generation
Factory-automation motor drives rely on the EPM570GM256C5N for deterministic PWM generation, dead-time insertion, Hall-sensor decoding, and protection logic. The 5 ns pin-to-pin logic delay gives sub-microsecond response to over-current and over-temperature faults, critical for IGBT/SiC inverter safety. The 160 I/Os allow direct interface to three-phase gate drivers, encoders, and the host DSP/FPGA without external muxes. The instant-on behavior ensures the motor drive boots into a safe state (gates low) within 200 µs of power-up, eliminating dangerous transient pulses during power-on sequencing.
Recomendado
Medical Instrumentation Glue Logic
In medical imaging carts, patient monitors, and bench-top analyzers, the EPM570GM256C5N serves as a low-power glue-logic hub between ADCs, DACs, displays, and a host processor. Its 0.18-um flash CMOS process yields low quiescent current, helping battery-powered portable monitors meet IEC 60601-1 energy budgets. The 160 user I/Os handle parallel TFT-LCD bridges, keypad scanners, audio CODEC interfaces, and SD-card multiplexers within a single device. Non-volatile instant-on configuration eliminates boot-time variability, important for clinical workflows where power-cycle-to-ready time must be reproducible.
Recomendado
Display Panel Timing Generator
Large LCD/OLED panels in industrial HMIs, point-of-sale terminals, and digital signage require a dedicated timing controller (TCON) that generates row/column driver waveforms, gamma correction tables, and backlight PWM. The EPM570GM256C5N provides the 160 I/Os and 5 ns logic delay needed to drive LVDS/FPD-Link bridges and to implement per-panel color-depth conversion in real time. Its multiVolt I/O banks interface to 1.8 V, 2.5 V, and 3.3 V source drivers without level shifters. The instant-on flash memory stores per-panel calibration coefficients, removing the need for an external EEPROM.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPM570GM256C5N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPM570GF256C5N | EPM1270GM256C5N | EPM2210GM256C5N | EPM570GM100C5N |
|---|---|---|---|---|---|
| Package | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch | 256-ball Micro FineLine BGA, 11x11 mm - same | 256-ball Micro FineLine BGA, 11x11 mm - same | 256-ball Micro FineLine BGA, 11x11 mm - same | 100-ball Micro FBGA - different |
| Brand | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) |
| Macro Cells | 440 | 440 | 1270 | 2210 | 440 |
| Logic Array Blocks (LABs) | 57 | 57 | 127 | 221 | 57 |
| Maximum User I/Os | 160 | 160 | 212 | 212 | 76 |
| Operating Voltage (VCCINT) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) |
| Pin-to-Pin Delay (Speed Grade C5) | 5 ns | 5 ns | 6 ns (C6 grade standard, C5 on request) | 7 ns (C7 grade standard) | 5 ns |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Configuration Memory | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) |
| Approx. Unit Price (qty 1, USD) | 26.80 | 26.00 | 40.00 | 62.00 | 20.00 |
Diferenciadores clave
- Highest-density non-volatile CPLD with 160 I/Os in 11x11 mm BGA (frente a EPM570GM100C5N (100-ball Micro FBGA))
- Instant-on non-volatile flash configuration (frente a SRAM-based FPGAs (e.g., Cyclone IV))
- Pin-compatible vertical-migration to higher densities (frente a EPM1270GM256C5N / EPM2210GM256C5N)
Notas de diseño
The 256-ball Micro FineLine BGA uses a 0.8 mm ball pitch, which demands NSMD (non-solder mask defined) pads with via-in-pad or microvia escape routing. Use at least 4 PCB layers with a continuous ground plane directly under the BGA. Stitching vias around the BGA perimeter at 1 mm spacing suppress ground bounce. For prototype builds, request gold-wire-ball or SAC305 lead-free balls from the distributor; non-leaded solder spheres require precise reflow profiling between 245 °C and 260 °C peak.
The MAX II family requires a clean 1.8 V VCCINT rail. Place a 0.1 µF X7R ceramic bypass capacitor directly at every VCCINT/GND pair (8 pairs in the 256-MBGA), plus one 4.7 µF bulk decoupling capacitor at the package entry point. Each I/O bank should have its own VCCIO rail and its own 0.1 µF + 1 µF decoupling pair; mixing bank supplies on a single ferrite risks simultaneous-switching-noise (SSN) coupling. Power-on ramp should be monotonic between 0 V and 1.89 V in less than 100 ms to satisfy MAX II configuration timing.
Do not confuse the EPM570GM256C5N ('GM' = Micro FineLine BGA, 11x11 mm, 0.8 mm pitch) with the EPM570F256C5N ('F' = FineLine BGA, 17x17 mm, 1.0 mm pitch). The two share the same die but have different ball maps and are NOT drop-in replacements. Also confirm the speed grade suffix - C5N specifies commercial temperature and 5 ns pin-to-pin delay, whereas C4N or C3N denote slower grades. Mixing speed grades in a JTAG chain can produce timing violations on TDO-to-TDI paths longer than 50 MHz; use a buffered JTAG chain for multi-device boards.
Long 160-I/O buses on the 256-MBGA benefit from series-damping resistors (22-33 Ω) on high-edge-rate outputs to control overshoot. The MAX II I/O slew-rate should be set to 'Slow' on buses longer than 50 mm to reduce SSN. For LVDS or LVPECL interfacing, use external resistor networks near the CPLD pin; the MAX II does not include true LVDS drivers. Always route the JTAG TCK signal as a 50 Ω microstrip with a 33 Ω source-termination resistor if the chain exceeds 100 mm.
Información de cumplimiento
RoHS / REACH / lead-free status not explicitly stated in the verified distributor snippets. Altera/Intel MAX II parts are typically RoHS-compliant but lot-by-lot verification with the manufacturer is recommended for new designs.
