EPM570M256I5N vs EPM570GM256I5N Comparación
Comparación detallada lado a lado de EPM570M256I5N por Intel y EPM570GM256I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570M256I5N | EPM570GM256I5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,66 | $21,40 |
| Family | MAX II | — |
| Macro Cells | 440 | — |
| Logic Elements | 570 | — |
| Number of User I/Os | 160 | — |
| Propagation Delay (tPD) | 5.4 ns | — |
| Maximum Frequency (fMAX) | 201.1 MHz | — |
| Operating Temperature (TJ) | -40C to +100C (industrial) | — |
| Operating Temperature (ambient) | -40C to +85C | — |
| Supply Voltage - Core | 2.5 V / 3.3 V internal | — |
| Supply Voltage - I/O | 1.5 V, 1.8 V, 2.5 V, 3.3 V (multi-voltage I/O bank) | — |
| Process Technology | 0.18 µm CMOS | 6-layer-metal flash CMOS |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Package Type | 256-MBGA (Micro FineLine BGA, 11x11 mm) | 256-TFBGA (MBGA), 11x11 mm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 | — |
| Lead Status | Lead Free | — |
| Programmability | In-System Programmable (JTAG/ISP) | — |
| Estado RoHS | Compliant | — |
| Device Family | — | MAX II |
| Series | — | MAX II G |
| Logic Elements (LE) | — | 570 |
| Macrocells | — | 440 |
| User I/Os | — | 160 |
| Propagation Delay (tpd) | — | 5.4 ns (max) |
| Internal Supply Voltage | — | 1.71 V to 1.89 V |
| Programmable Type | — | In-System Programmable (ISP) |
| Temperatura de funcionamiento | — | -40 C to +100 C (TJ, industrial) |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| JTAG / Boundary Scan | — | IEEE 1149.1 compliant |