EPM570ZF256C7N vs EPM570GM256I5N Comparación
Comparación detallada lado a lado de EPM570ZF256C7N por Intel y EPM570GM256I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570ZF256C7N | EPM570GM256I5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,85 | $21,40 |
| Series | MAX II | MAX II G |
| Programmable Type | In System Programmable | In-System Programmable (ISP) |
| Macro Cells | 440 | — |
| Logic Elements (LE) | 440 | 570 |
| Embedded Flash Memory | 8 Kbit | — |
| Pin-to-Pin Logic Delay (tPD) | 9 ns | — |
| Maximum Operating Frequency | 201 MHz (internal) | — |
| Maximum User I/O Pins | 160 | — |
| Supply Voltage - Internal (VCCINT) | 1.71 V to 1.89 V | — |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Supplier Device Package | 256-MBGA (11x11 mm) | — |
| Package Type Code | 256-FBGA / 256-TFBGA | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 0.18 µm flash-based CMOS | 6-layer-metal flash CMOS |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Rango de temperatura de funcionamiento | 0 °C to +85 °C (commercial, suffix 'C') | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | — |
| Lead-Free Status | Lead free | — |
| Device Family | — | MAX II |
| Macrocells | — | 440 |
| User I/Os | — | 160 |
| Propagation Delay (tpd) | — | 5.4 ns (max) |
| Internal Supply Voltage | — | 1.71 V to 1.89 V |
| User Flash Memory (UFM) | — | 8 Kbits |
| Temperatura de funcionamiento | — | -40 C to +100 C (TJ, industrial) |
| Package Type | — | 256-TFBGA (MBGA), 11x11 mm |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| JTAG / Boundary Scan | — | IEEE 1149.1 compliant |