H5AN4G6NBJR-RDC vs H5AN4G6NBJR-VKC Comparación
Comparación detallada lado a lado de H5AN4G6NBJR-RDC por SK hynix y H5AN4G6NBJR-VKC por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5AN4G6NBJR-RDC | H5AN4G6NBJR-VKC |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,15 | $12,96 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | — |
| Organización de memoria | 256M x 16 | — |
| Tensión de alimentación | 1.2 V | — |
| Interfaz | CMOS, fully synchronous | Parallel |
| Package Code | TFBGA (FBGA-96) | — |
| Package Shape | Rectangular | — |
| Package Width | 7.5 mm | — |
| Number of Terminals | 96 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperature Grade | OTHER (per Partstack listing); -I industrial option -40C to +95C per family datasheet | — |
| Self Refresh | Auto / Self Refresh | — |
| Data Mask Function | Yes | — |
| Asynchronous Reset | Yes | — |
| On-Die Termination | Dynamic ODT | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| CRC Function | Yes | — |
| Lead-Free / Halogen-Free | Yes (per datasheet cover: Lead-Free & Halogen-Free) | — |
| Speed Grade | -RDC (see manufacturer datasheet for validated data-rate bin) | — |
| Tamaño de memoria | — | 4 Gbit |
| Memory Organization | — | 256M x 16 |
| Velocidad de datos | — | 2666 Mbps |
| Clock Frequency | — | 1.6 GHz (internal reference per distributor data) |
| Supply Voltage (VDD) | — | 1.2 V nominal (1.14 V to 1.26 V) |
| Operating Current | — | 38 mA (typical, per distributor data) |
| Technology | — | CMOS |
| Temperatura de funcionamiento | — | -40C to +95C |
| Encapsulado | — | FBGA-96 / TFBGA (PBGA96) |
| Body Size | — | 13 mm, 1.2 mm profile, 0.8 mm ball pitch |
| Termination | — | Dynamic on-chip termination (ODT) |
| Calibration | — | ZQ calibration; write leveling |
| Protection Functions | — | Asynchronous reset; CRC; data mask |
| Refresh | — | Auto self-refresh |
| Estado RoHS | — | Compliant |
| Packaging | — | Tray |