IRF4905STRRPBF vs IRF5305STRRPBF Comparación
Comparación detallada lado a lado de IRF4905STRRPBF por Infineon y IRF5305STRRPBF por Infineon. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | IRF4905STRRPBF | IRF5305STRRPBF |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoría | MOSFETs | MOSFETs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,94 | $0,62 |
| Polarity | P-Channel | P-Channel |
| Drain-Source Voltage (VDS) | -55 V | — |
| Continuous Drain Current (ID) at TC=25C | -74 A | — |
| Continuous Drain Current (ID) at TC=100C | [DATA_NEEDED: ID at TC=100C] | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current] | [DATA_NEEDED: pulsed drain current] |
| Gate-Source Voltage (VGS) max | ±20 V | — |
| RDS(on) max at VGS=-10V | 20 mOhm | — |
| RDS(on) max at VGS=-4.5V | [DATA_NEEDED: RDS(on) at VGS=-4.5V] | — |
| Gate Threshold Voltage (VGS(th)) | -2.0 V to -4.0 V | [DATA_NEEDED: VGS(th) typical/min] |
| Total Gate Charge (Qg) | 120 nC | — |
| Power Dissipation (PD) at TC=25C | 170 W | — |
| Temperatura de unión de funcionamiento | -55 C to +175 C | -55C to +175C |
| Encapsulado | D2PAK (TO-263-3) | D2PAK (TO-263) Surface Mount |
| Tipo de montaje | Surface Mount | Surface Mount |
| Technology | HEXFET (Advanced Process) | HEXFET (Advanced Process) |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Tipo de transistor | — | P-Channel MOSFET |
| Drain-to-Source Voltage (VDS) | — | -55 V |
| Continuous Drain Current (ID) at TC | — | -31 A |
| Gate-to-Source Voltage (VGS) max | — | ±20 V |
| RDS(on) max @ VGS=-10V | — | 60 mOhm |
| Power Dissipation (TC) | — | 110 W |
| Power Dissipation (TA) | — | 3.8 W |
| Lead-Free / RoHS | — | Yes (Pb-free suffix) |
| Packaging | — | Tape & Reel (TR) |