IRFZ48NSTRLPBF vs IRLR3636TRPBF Comparación
Comparación detallada lado a lado de IRFZ48NSTRLPBF por Infineon y IRLR3636TRPBF por Infineon. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | IRFZ48NSTRLPBF | IRLR3636TRPBF |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoría | MOSFETs | MOSFETs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,18 | $2,38 |
| FET Type | N-Channel Power MOSFET | N-Channel MOSFET, Metal Oxide |
| Drain-to-Source Voltage (VDS) | 55 V | — |
| Continuous Drain Current (ID) @ Tc=25C | 64 A | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current] | — |
| Static Drain-to-Source On-Resistance (Rds(on)) | 14 mΩ at VGS = 10 V | — |
| Gate-to-Source Threshold Voltage (VGS(th)) | 2.0 V to 4.0 V | — |
| Total Gate Charge (Qg) | 54 nC | — |
| Gate-to-Source Voltage (VGS) max | ±20 V | — |
| Power Dissipation (Pd) @ Tc=25C | 130 W | — |
| Power Dissipation (Pd) @ Ta=25C on FR-4 | 3.8 W | — |
| Temperatura de unión de funcionamiento | -55C to +175C | — |
| Encapsulado | D2PAK (TO-263) Surface Mount | TO-252AA (DPAK) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (13-inch reel, TRL) | — |
| Lead Finish | Lead-free (PBF) matte tin | — |
| Estado RoHS | Compliant | Compliant |
| Technology Family | HEXFET advanced process technology | — |
| Drain-to-Source Voltage (V_DSS) | — | 60 V |
| Continuous Drain Current (I_D) at T_C = 25C | — | 50 A |
| Continuous Drain Current (I_D) at T_C = 100C | — | [DATA_NEEDED: I_D at 100C] |
| Pulsed Drain Current (I_DM) | — | [DATA_NEEDED: pulsed drain current] |
| Maximum R_DS(on) at V_GS = 10V | — | 6.8 mOhm |
| Typical R_DS(on) at V_GS = 10V | — | 5.4 mOhm |
| Gate Threshold Voltage (V_GS(th)) | — | [DATA_NEEDED: V_GS(th) range] |
| Total Gate Charge (Q_G) | — | 33 nC |
| Maximum Power Dissition (P_D) at T_C = 25C | — | 143 W |
| Rango de temperatura de funcionamiento | — | -55C to +175C |
| Technology | — | IR HEXFET / IR MOSFET |
| Lead-Free | — | Yes (PBF suffix) |