K3KLALA0DM-JGCT vs K3KL9L90DM-JGCT Comparación
Comparación detallada lado a lado de K3KLALA0DM-JGCT por Samsung Electronics y K3KL9L90DM-JGCT por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Samsung Electronics
K3KLALA0DM-JGCT - LPDDR5X DRAM x32 | Samsung Semiconductor
K3KLALA0DM-JGCT ✓ ActivoSamsung Electronics
K3KL9L90DM-JGCT - LPDDR5X DRAM 16Gbit FBGA-315 | Samsung
K3KL9L90DM-JGCT ✓ ActivoComparación de especificaciones
| Parámetro | K3KLALA0DM-JGCT | K3KL9L90DM-JGCT |
|---|---|---|
| Marca | Samsung Electronics | Samsung Electronics |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $65,18 |
| Manufacturer | Samsung Electronics | — |
| Tipo de memoria | LPDDR5X SDRAM | LPDDR5X SDRAM |
| Organización de memoria | x32 | [DATA_NEEDED: x organization] |
| Product Status | Mass Production | — |
| Family Max Data Rate | Up to 8.5 Gbps (LPDDR5X family) | — |
| Family Power Efficiency | Approx. 20% better than LPDDR5 | — |
| Family Max Density | Up to 64 GB (family) | — |
| Density | [DATA_NEEDED: density per die] | 16 Gbit |
| Data Rate (this speed grade) | [DATA_NEEDED: Mbps speed grade] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD voltage] | [DATA_NEEDED: core supply voltage] |
| Supply Voltage (VDDQ) | [DATA_NEEDED: VDDQ voltage] | — |
| Package Type | [DATA_NEEDED: FBGA ball count / package code] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Tipo de montaje | Surface Mount | Surface Mount |
| Standards Compliance | JEDEC LPDDR5X | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Encapsulado | — | FBGA-315 |
| Velocidad de datos | — | [DATA_NEEDED: data rate for JGCT speed grade] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: I/O supply voltage] |
| Bank Architecture | — | [DATA_NEEDED: bank/group configuration] |
| Interfaz | — | [DATA_NEEDED: channel configuration] |
| Nivel MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Package Dimensions | — | [DATA_NEEDED: body dimensions] |
| AEC-Q100 | — | [DATA_NEEDED: automotive qualification status] |