K3LK4L40DM-BGCT vs K3LK8L80CM-MGCT Comparación
Comparación detallada lado a lado de K3LK4L40DM-BGCT por Samsung Electronics y K3LK8L80CM-MGCT por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Samsung Electronics
K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics
K3LK4L40DM-BGCT ✓ ActivoSamsung Electronics
K3LK8L80CM-MGCT - LPDDR5X 32Gbit DRAM FBGA-315 | Samsung
K3LK8L80CM-MGCT ✓ ActivoComparación de especificaciones
| Parámetro | K3LK4L40DM-BGCT | K3LK8L80CM-MGCT |
|---|---|---|
| Marca | Samsung Electronics | Samsung Electronics |
| Categoría | DRAM | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $40,50 | $0,00 |
| Tipo de memoria | DRAM (SDRAM component) | LPDDR5X SDRAM |
| Manufacturer | Samsung Electronics | — |
| Density | [DATA_NEEDED: Density] | 32 Gbit (4 GB) |
| Organization (x-width) | [DATA_NEEDED: Organization] | — |
| Velocidad de datos | [DATA_NEEDED: Data Rate] | — |
| Supply Voltage Class | [DATA_NEEDED: Supply Voltage] | — |
| Latencia CAS | [DATA_NEEDED: CAS Latency] | — |
| Package Type | BGA (per -BGC ordering-code suffix) | — |
| Package Ball Count | [DATA_NEEDED: Ball Count] | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature Range] | -25C to +85C |
| Refresh Rate | [DATA_NEEDED: Refresh Interval] | — |
| Estado RoHS | [DATA_NEEDED: RoHS Status] | Compliant (per JLCPCB listing) |
| Lead Free | [DATA_NEEDED: Lead-Free Status] | — |
| Nivel MSL | [DATA_NEEDED: Moisture Sensitivity Level] | [DATA_NEEDED: MSL level] |
| Packaging | Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging] | — |
| Organización de memoria | — | x32 |
| Max Data Rate | — | 7500 Mbps |
| Supply Voltages | — | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) |
| Encapsulado | — | FBGA-315 (315-ball) |
| Interfaz | — | LPDDR5X (JEDEC low-power DDR) |
| Power Efficiency | — | ~25% improvement vs LPDDR5 |
| Application Class | — | Mobile, PC, automotive, on-device AI |
| Speed Grade Suffix | — | CM-MGCT |
| Package Family | — | FBGA -> BGA -> surface mount |
| Typical End Products | — | Smartphones, tablets, edge AI devices |
| Refresh / Standby Modes | — | Self-refresh, deep power-down (per LPDDR5X protocol) |