K3LK4L40DM-BGCT vs K3LK8L80CM-MGCT 对比
详细并排对比 K3LK4L40DM-BGCT 出自 Samsung Electronics 和 K3LK8L80CM-MGCT 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Samsung Electronics
K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics
K3LK4L40DM-BGCT ✓ 量产中
规格对比
| 参数 | K3LK4L40DM-BGCT | K3LK8L80CM-MGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | DRAM | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $40.50 | $0.00 |
| 存储器类型 | DRAM (SDRAM component) | LPDDR5X SDRAM |
| Manufacturer | Samsung Electronics | — |
| Density | [DATA_NEEDED: Density] | 32 Gbit (4 GB) |
| Organization (x-width) | [DATA_NEEDED: Organization] | — |
| 数据速率 | [DATA_NEEDED: Data Rate] | — |
| Supply Voltage Class | [DATA_NEEDED: Supply Voltage] | — |
| CAS 延迟 | [DATA_NEEDED: CAS Latency] | — |
| Package Type | BGA (per -BGC ordering-code suffix) | — |
| Package Ball Count | [DATA_NEEDED: Ball Count] | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| 工作温度 | [DATA_NEEDED: Operating Temperature Range] | -25C to +85C |
| Refresh Rate | [DATA_NEEDED: Refresh Interval] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS Status] | Compliant (per JLCPCB listing) |
| Lead Free | [DATA_NEEDED: Lead-Free Status] | — |
| MSL 等级 | [DATA_NEEDED: Moisture Sensitivity Level] | [DATA_NEEDED: MSL level] |
| Packaging | Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging] | — |
| 存储组织 | — | x32 |
| Max Data Rate | — | 7500 Mbps |
| Supply Voltages | — | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) |
| 封装 | — | FBGA-315 (315-ball) |
| 接口 | — | LPDDR5X (JEDEC low-power DDR) |
| Power Efficiency | — | ~25% improvement vs LPDDR5 |
| Application Class | — | Mobile, PC, automotive, on-device AI |
| Speed Grade Suffix | — | CM-MGCT |
| Package Family | — | FBGA -> BGA -> surface mount |
| Typical End Products | — | Smartphones, tablets, edge AI devices |
| Refresh / Standby Modes | — | Self-refresh, deep power-down (per LPDDR5X protocol) |