K4AAG165WA-BCRC vs K4AAG165WA-BCPB Comparación
Comparación detallada lado a lado de K4AAG165WA-BCRC por Samsung Electronics y K4AAG165WA-BCPB por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Samsung Electronics
K4AAG165WA-BCRC - 16Gb DDR4 SDRAM, FBGA-96 | Samsung | DRAM
K4AAG165WA-BCRC ✓ ActivoSamsung Electronics
K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4AAG165WA-BCPB ✓ ActivoComparación de especificaciones
| Parámetro | K4AAG165WA-BCRC | K4AAG165WA-BCPB |
|---|---|---|
| Marca | Samsung Electronics | Samsung Electronics |
| Categoría | DRAM | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $64,90 | $63,79 |
| Tipo de memoria | DDR4 SDRAM (Volatile DRAM) | Volatile DRAM (DDR4 SDRAM) |
| Tamaño de memoria | 16 Gb (2 GB) | — |
| Memory Organization | 1G x 16 | — |
| Memory Interface | DDR4 SDRAM Interface | — |
| Tensión de alimentación | 1.2 V | — |
| Velocidad de datos | up to 3200 Mbps per pin (family); [DATA_NEEDED: BCRC speed grade rating] | 3200 Mbps |
| Technology | DDR4 | DDR4 |
| Encapsulado | FBGA-96 (96-ball Fine-Pitch Ball Grid Array) | FBGA-96 |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: BCRC temperature range; family BCWE rated -40C to +95C] | [DATA_NEEDED: operating temperature for BCPB grade] |
| Speed Grade Suffix | -BCRC | — |
| Datasheet | Samsung K4AAG165WA DDR4 SDRAM Memory, 23 pages | — |
| Packaging Status | [DATA_NEEDED: tray/reel standard quantity] | — |
| Clock Frequency | [DATA_NEEDED: BCRC clock frequency] | — |
| Memory Format | DRAM | DRAM |
| Estado RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Density | — | 16 Gb |
| Organización de memoria | — | 1G x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Interface Voltage (VDDQ) | — | 1.2 V |
| Packaging | — | Tray |
| Product Status | — | Active |
| Power Consumption | — | 25% lower than DDR3 (per Samsung DDR4 family) |
| Bank Group Architecture | — | Yes (DDR4 internal bank groups) |
| On-Die Termination (ODT) | — | Yes |
| Max Capacity Family | — | Up to 32GB component (Samsung DDR4 family) |