K4AAG165WA-BCRC vs K4AAG165WA-BCPB Comparaison
Comparaison détaillée côte à côte de K4AAG165WA-BCRC par Samsung Electronics et K4AAG165WA-BCPB par Samsung Electronics. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Samsung Electronics
K4AAG165WA-BCRC - 16Gb DDR4 SDRAM, FBGA-96 | Samsung | DRAM
K4AAG165WA-BCRC ✓ ActifSamsung Electronics
K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4AAG165WA-BCPB ✓ ActifComparaison des spécifications
| Paramètre | K4AAG165WA-BCRC | K4AAG165WA-BCPB |
|---|---|---|
| Marque | Samsung Electronics | Samsung Electronics |
| Catégorie | DRAM | Memory ICs |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $64,90 | $63,79 |
| Type de mémoire | DDR4 SDRAM (Volatile DRAM) | Volatile DRAM (DDR4 SDRAM) |
| Taille de mémoire | 16 Gb (2 GB) | — |
| Memory Organization | 1G x 16 | — |
| Memory Interface | DDR4 SDRAM Interface | — |
| Tension d'alimentation | 1.2 V | — |
| Débit de données | up to 3200 Mbps per pin (family); [DATA_NEEDED: BCRC speed grade rating] | 3200 Mbps |
| Technology | DDR4 | DDR4 |
| Boîtier | FBGA-96 (96-ball Fine-Pitch Ball Grid Array) | FBGA-96 |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | [DATA_NEEDED: BCRC temperature range; family BCWE rated -40C to +95C] | [DATA_NEEDED: operating temperature for BCPB grade] |
| Speed Grade Suffix | -BCRC | — |
| Datasheet | Samsung K4AAG165WA DDR4 SDRAM Memory, 23 pages | — |
| Packaging Status | [DATA_NEEDED: tray/reel standard quantity] | — |
| Clock Frequency | [DATA_NEEDED: BCRC clock frequency] | — |
| Memory Format | DRAM | DRAM |
| Statut RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Density | — | 16 Gb |
| Organisation de la mémoire | — | 1G x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Interface Voltage (VDDQ) | — | 1.2 V |
| Packaging | — | Tray |
| Product Status | — | Active |
| Power Consumption | — | 25% lower than DDR3 (per Samsung DDR4 family) |
| Bank Group Architecture | — | Yes (DDR4 internal bank groups) |
| On-Die Termination (ODT) | — | Yes |
| Max Capacity Family | — | Up to 32GB component (Samsung DDR4 family) |