K4AAG165WM-BCWE vs MT40A256M16GE-075E:B Comparación
Comparación detallada lado a lado de K4AAG165WM-BCWE por Samsung Electronics y MT40A256M16GE-075E:B por Micron Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Micron Technology
MT40A256M16GE-075E:B - 4Gb DDR4 SDRAM 2666 MT/s | Micron
MT40A256M16GE-075E:B ✓ ActivoComparación de especificaciones
| Parámetro | K4AAG165WM-BCWE | MT40A256M16GE-075E:B |
|---|---|---|
| Marca | Samsung Electronics | Micron Technology |
| Categoría | DRAM | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $54,65 | $3,95 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | — |
| Organización de memoria | 256M x 16 (1G x 16) | 256M x 16 |
| Velocidad de datos | 3200 Mbps | 2666 MT/s (DDR4-2666) |
| Interfaz | Parallel (DDR4) | — |
| Supply Voltage VDD | 1.2 V | — |
| Supply Voltage VDDQ | 1.2 V | — |
| Access Time (Clock Cycle Time) | [DATA_NEEDED: tCK for BCWE bin] | — |
| Latencia CAS | [DATA_NEEDED: CL at 3200 Mbps] | — |
| Bank Groups | 4 (x16 configuration) | — |
| Burst Length | 8 | — |
| Encapsulado | 78-ball FBGA | 96-FBGA (9 x 14 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: temperature range for WM-BCWE] | [DATA_NEEDED: operating temperature range for standard grade] |
| Die Revision | W (WM suffix) | — |
| Estado RoHS | Compliant | — |
| Operating Frequency | 1600 MHz (DDR, 3200 Mbps) | — |
| Tamaño de memoria | — | 4 Gbit |
| Memory Interface | — | Parallel |
| Clock Frequency | — | 1.33 GHz |
| VDD / VDDQ | — | 1.2 V +/-60 mV |
| VPP | — | 2.5 V, -125 mV/+250 mV |
| Internal Banks | — | 16 |
| Refresh | — | 64 ms / 8192-cycle; 32 ms / 8192-cycle at 95C |
| I/O Type | — | 1.2 V pseudo open-drain |
| VREFDQ | — | On-die, internal, adjustable generation |
| Special Features | — | Temperature controlled refresh (TCR) |
| Access Time | — | [DATA_NEEDED: CAS latency / access time] |