K4AAG165WM-BCWE vs MT40A256M16GE-075E:B 对比
详细并排对比 K4AAG165WM-BCWE 出自 Samsung Electronics 和 MT40A256M16GE-075E:B 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Micron Technology
MT40A256M16GE-075E:B - 4Gb DDR4 SDRAM 2666 MT/s | Micron
MT40A256M16GE-075E:B ✓ 量产中规格对比
| 参数 | K4AAG165WM-BCWE | MT40A256M16GE-075E:B |
|---|---|---|
| 品牌 | Samsung Electronics | Micron Technology |
| 分类 | DRAM | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $54.65 | $3.95 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | — |
| 存储组织 | 256M x 16 (1G x 16) | 256M x 16 |
| 数据速率 | 3200 Mbps | 2666 MT/s (DDR4-2666) |
| 接口 | Parallel (DDR4) | — |
| Supply Voltage VDD | 1.2 V | — |
| Supply Voltage VDDQ | 1.2 V | — |
| Access Time (Clock Cycle Time) | [DATA_NEEDED: tCK for BCWE bin] | — |
| CAS 延迟 | [DATA_NEEDED: CL at 3200 Mbps] | — |
| Bank Groups | 4 (x16 configuration) | — |
| Burst Length | 8 | — |
| 封装 | 78-ball FBGA | 96-FBGA (9 x 14 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: temperature range for WM-BCWE] | [DATA_NEEDED: operating temperature range for standard grade] |
| Die Revision | W (WM suffix) | — |
| RoHS 状态 | Compliant | — |
| Operating Frequency | 1600 MHz (DDR, 3200 Mbps) | — |
| 存储容量 | — | 4 Gbit |
| Memory Interface | — | Parallel |
| Clock Frequency | — | 1.33 GHz |
| VDD / VDDQ | — | 1.2 V +/-60 mV |
| VPP | — | 2.5 V, -125 mV/+250 mV |
| Internal Banks | — | 16 |
| Refresh | — | 64 ms / 8192-cycle; 32 ms / 8192-cycle at 95C |
| I/O Type | — | 1.2 V pseudo open-drain |
| VREFDQ | — | On-die, internal, adjustable generation |
| Special Features | — | Temperature controlled refresh (TCR) |
| Access Time | — | [DATA_NEEDED: CAS latency / access time] |