LCMXO3LF-6900E-5MG256I vs LFE5U-45F-8BG256I Comparación
Comparación detallada lado a lado de LCMXO3LF-6900E-5MG256I por Lattice Semiconductor y LFE5U-45F-8BG256I por Lattice Semiconductor. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Lattice Semiconductor
LCMXO3LF-6900E-5MG256I - 6864 LUT MachXO3LF FPGA | Lattice
LCMXO3LF-6900E-5MG256I ✓ ActivoLattice Semiconductor
LFE5U-45F-8BG256I - 44K LUT ECP5 FPGA, 256-BGA Industrial | Lattice
LFE5U-45F-8BG256I ✓ ActivoComparación de especificaciones
| Parámetro | LCMXO3LF-6900E-5MG256I | LFE5U-45F-8BG256I |
|---|---|---|
| Marca | Lattice Semiconductor | Lattice Semiconductor |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,68 | $21,85 |
| Family | MachXO3LF | LatticeECP5 |
| Series / Grade | 6900E | — |
| Logic Elements / LUTs | 6,864 LUTs | — |
| User I/O Count | 206 | — |
| Embedded Memory | 245,760 bits | — |
| Configuration Memory | On-chip Flash (non-volatile) | — |
| Core Voltage | 1.2 V | 1.1 V |
| Single-Rail Supply Option | 2.5 V / 3.3 V | — |
| Process Technology | 65 nm Flash + CMOS | — |
| Encapsulado | 256-ball csfBGA (MG256), 0.5 mm pitch | 256-LFBGA (caBGA, 17x17 mm, 1.0 mm pitch) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | -5 | — |
| I/O Banks | Multiple banks (LVCMOS 1.2 V - 3.3 V, LVDS) | — |
| Configuration Interfaces | I2C / SPI / Slave JTAG | — |
| PLLs | 2 PLL pairs | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | LFE5U |
| Logic Elements / LUTs (4-input) | — | 44000 LUTs (nominal) |
| Total Block RAM | — | 1944 Kbit (approx. 1,990,656 bits) |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| User I/O (this package) | — | 197 |
| Process Node | — | 40 nm |
| Nivel MSL | — | 3 |
| Peak Reflow Temperature | — | 260 C |
| Time at Peak Reflow | — | 30 s |
| Terminal Finish | — | Tin-Silver-Copper (e1 per JESD-609) |
| Configuration Interface | — | JTAG (IEEE 1149.1), SPI, Dual-Boot / Multi-Boot |
| TransFR (Transparent Field Reconfiguration) | — | Supported |
| Boundary Scan | — | IEEE 1149.1 compliant |
| Estado del ciclo de vida | — | Active |