LCMXO3LF-6900E-5MG256I vs LFE5U-45F-8BG256I Comparaison
Comparaison détaillée côte à côte de LCMXO3LF-6900E-5MG256I par Lattice Semiconductor et LFE5U-45F-8BG256I par Lattice Semiconductor. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Lattice Semiconductor
LCMXO3LF-6900E-5MG256I - 6864 LUT MachXO3LF FPGA | Lattice
LCMXO3LF-6900E-5MG256I ✓ ActifLattice Semiconductor
LFE5U-45F-8BG256I - 44K LUT ECP5 FPGA, 256-BGA Industrial | Lattice
LFE5U-45F-8BG256I ✓ ActifComparaison des spécifications
| Paramètre | LCMXO3LF-6900E-5MG256I | LFE5U-45F-8BG256I |
|---|---|---|
| Marque | Lattice Semiconductor | Lattice Semiconductor |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $15,68 | $21,85 |
| Family | MachXO3LF | LatticeECP5 |
| Series / Grade | 6900E | — |
| Logic Elements / LUTs | 6,864 LUTs | — |
| User I/O Count | 206 | — |
| Embedded Memory | 245,760 bits | — |
| Configuration Memory | On-chip Flash (non-volatile) | — |
| Core Voltage | 1.2 V | 1.1 V |
| Single-Rail Supply Option | 2.5 V / 3.3 V | — |
| Process Technology | 65 nm Flash + CMOS | — |
| Boîtier | 256-ball csfBGA (MG256), 0.5 mm pitch | 256-LFBGA (caBGA, 17x17 mm, 1.0 mm pitch) |
| Température de fonctionnement | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | -5 | — |
| I/O Banks | Multiple banks (LVCMOS 1.2 V - 3.3 V, LVDS) | — |
| Configuration Interfaces | I2C / SPI / Slave JTAG | — |
| PLLs | 2 PLL pairs | — |
| Statut RoHS | Compliant | Compliant |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | LFE5U |
| Logic Elements / LUTs (4-input) | — | 44000 LUTs (nominal) |
| Total Block RAM | — | 1944 Kbit (approx. 1,990,656 bits) |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| User I/O (this package) | — | 197 |
| Process Node | — | 40 nm |
| Niveau MSL | — | 3 |
| Peak Reflow Temperature | — | 260 C |
| Time at Peak Reflow | — | 30 s |
| Terminal Finish | — | Tin-Silver-Copper (e1 per JESD-609) |
| Configuration Interface | — | JTAG (IEEE 1149.1), SPI, Dual-Boot / Multi-Boot |
| TransFR (Transparent Field Reconfiguration) | — | Supported |
| Boundary Scan | — | IEEE 1149.1 compliant |
| Statut du cycle de vie | — | Active |