LPC5526JBD64K vs LPC5526JBD64E Comparación
Comparación detallada lado a lado de LPC5526JBD64K por NXP Semiconductors y LPC5526JBD64E por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | LPC5526JBD64K | LPC5526JBD64E |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,52 | $2,95 |
| Core Processor | Arm Cortex-M33 (r0p3) | ARM Cortex-M33 (r0p3) |
| Core Size | 32-Bit | 32-Bit |
| Frecuencia de reloj máxima | 150 MHz | 150 MHz |
| Flash Memory | 256 KB (256K x 8) | 256KB (256K x 8) |
| SRAM | [DATA_NEEDED: SRAM size] | — |
| Tensión de alimentación | 3.3 V | [DATA_NEEDED: supply voltage range] |
| Encapsulado | 64-HTQFP (10x10 mm) with exposed pad | 64-HTQFP (10x10 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Memory Protection Unit (MPU) | Yes | — |
| Interrupt Controller | NVIC (Nested Vectored Interrupt Controller) | NVIC (built-in) |
| NMI Input | Yes, with selectable sources | Yes, with selection of sources |
| Serial Interfaces | FlexComm (UART/SPI/I2C), USB HS, SDIO (family features) | — |
| ADC | 16-bit, 1.0 Msamples/sec (family feature) | — |
| Timer/Counter | 32-bit counter/timers, SCTimer/PWM (family feature) | — |
| Logic Expansion | Programmable Logic Unit (PLU) (family feature) | — |
| Process Technology | 40-nm NVM | 40 nm NVM |
| Estado del ciclo de vida | Active | Active |
| RAM Size | — | [DATA_NEEDED: SRAM size] |
| Security Feature | — | ARM TrustZone |
| Memory Protection Unit | — | Yes (MPU) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: temperature range] |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260 C |
| Max Time At Peak Reflow | — | 30 s |
| Terminal Finish | — | Tin (JESD-609 code e3) |
| Estado RoHS | — | Compliant |