M1AFS1500-1FG256I vs M1AFS1500-2FGG256 Comparación
Comparación detallada lado a lado de M1AFS1500-1FG256I por Microchip Technology y M1AFS1500-2FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ ActivoMicrochip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-1FG256I | M1AFS1500-2FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $205,00 | $124,50 |
| Logic Capacity | 1,500,000 system gates | — |
| User I/O | 119 | — |
| Processor Core | ARM Cortex-M1 (M1 variant) | — |
| Memory Resource | 276480 bits | — |
| Configuration Technology | Flash-based, nonvolatile | — |
| Process Technology | 130 nm CMOS, 7-layer metal | — |
| Core Supply Voltage | 1.5 V | — |
| System Performance | up to 350 MHz | — |
| Encapsulado | 256-LBGA (FG256) | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +85C (industrial grade, suffix I) | — |
| Speed Grade | -1 (standard) | -2 |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Analog Functionality | Fusion configurable analog blocks | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| Estado RoHS | Non-Compliant (contains lead, per distributor data) | — |
| Lead-Free Status | Contains Lead | — |
| Series | — | M1AFS1500 (Fusion) |
| System Gates | — | 1,500,000 |
| Logic Cells | — | 38,400 |
| Embedded Processor | — | ARM Cortex-M1 |
| Frecuencia de reloj máxima | — | 350 MHz |
| Number of I/O | — | 119 |
| Tensión de alimentación de funcionamiento | — | 1.5 V |
| Flash Memory Bits (reported) | — | 276480 |
| Technology | — | CMOS, 130nm class |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Estilo de montaje | — | SMD/SMT |
| Rango de temperatura de funcionamiento | — | 0C to +70C |
| Analog Blocks | — | Configurable analog (Fusion mixed-signal architecture) |
| Programming Type | — | Flash-based (in-system programmable) |
| Packaging | — | Tray |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Total RAM Blocks | — | [DATA_NEEDED: RAM block count] |