M1AFS1500-1FG256I vs M1AFS1500-2FGG256 Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FG256I von Microchip Technology und M1AFS1500-2FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ AktivMicrochip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FG256I | M1AFS1500-2FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $205,00 | $124,50 |
| Logic Capacity | 1,500,000 system gates | — |
| User I/O | 119 | — |
| Processor Core | ARM Cortex-M1 (M1 variant) | — |
| Memory Resource | 276480 bits | — |
| Configuration Technology | Flash-based, nonvolatile | — |
| Process Technology | 130 nm CMOS, 7-layer metal | — |
| Core Supply Voltage | 1.5 V | — |
| System Performance | up to 350 MHz | — |
| Gehäuse | 256-LBGA (FG256) | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | -40C to +85C (industrial grade, suffix I) | — |
| Speed Grade | -1 (standard) | -2 |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Analog Functionality | Fusion configurable analog blocks | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| RoHS-Status | Non-Compliant (contains lead, per distributor data) | — |
| Lead-Free Status | Contains Lead | — |
| Series | — | M1AFS1500 (Fusion) |
| System Gates | — | 1,500,000 |
| Logic Cells | — | 38,400 |
| Embedded Processor | — | ARM Cortex-M1 |
| Maximale Taktfrequenz | — | 350 MHz |
| Number of I/O | — | 119 |
| Betriebsversorgungsspannung | — | 1.5 V |
| Flash Memory Bits (reported) | — | 276480 |
| Technology | — | CMOS, 130nm class |
| Gehäuse / Bauform | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Montagestil | — | SMD/SMT |
| Betriebstemperaturbereich | — | 0C to +70C |
| Analog Blocks | — | Configurable analog (Fusion mixed-signal architecture) |
| Programming Type | — | Flash-based (in-system programmable) |
| Packaging | — | Tray |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Total RAM Blocks | — | [DATA_NEEDED: RAM block count] |