M1AFS1500-1FG256K vs M1AFS1500-1FG256I Comparación

Comparación detallada lado a lado de M1AFS1500-1FG256K por Microchip Technology y M1AFS1500-1FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
M1AFS1500-1FG256K M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip

M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip

M1AFS1500-1FG256K ✓ Activo
Microchip Technology
M1AFS1500-1FG256I M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip

M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip

M1AFS1500-1FG256I ✓ Activo

Comparación de especificaciones

Parámetro M1AFS1500-1FG256K M1AFS1500-1FG256I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $627,13 $205,00
Manufacturer Microchip Technology —
Family Fusion (Mixed-Signal Flash FPGA) —
System Gates 1500000 —
Logic Cells 38400 —
Number of I/O 119 —
Flash Memory 276480 bits —
Processor Core ARM Cortex-M1 (soft core) ARM Cortex-M1 (M1 variant)
Speed Grade -1 -1 (standard)
Encapsulado 256-LBGA (FG256) 256-LBGA (FG256)
Tipo de montaje Surface Mount Surface Mount
Configuration Technology Flash (instant-on, single-chip) Flash-based, nonvolatile
Analog Features Configurable analog blocks (Fusion mixed-signal) —
Programmability In-System Programmable —
Estado RoHS RoHS Non-Compliant Non-Compliant (contains lead, per distributor data)
Lead Free Status Contains Lead —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] -40C to +85C (industrial grade, suffix I)
Core Supply Voltage [DATA_NEEDED: core supply voltage] 1.5 V
Embedded Memory Blocks [DATA_NEEDED: SRAM block size] —
Nivel MSL [DATA_NEEDED: moisture sensitivity level] —
Logic Capacity — 1,500,000 system gates
User I/O — 119
Memory Resource — 276480 bits
Process Technology — 130 nm CMOS, 7-layer metal
System Performance — up to 350 MHz
Power-Up Behavior — Live at Power-Up (LAPU)
Analog Functionality — Fusion configurable analog blocks
Clock Management — Integrated clock generation and management circuitry
Lead-Free Status — Contains Lead

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