M1AFS1500-1FG256K vs M1AFS1500-1FG256I Vergleich

Detaillierter Direktvergleich von M1AFS1500-1FG256K von Microchip Technology und M1AFS1500-1FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS1500-1FG256K M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip

M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip

M1AFS1500-1FG256K ✓ Aktiv
Microchip Technology
M1AFS1500-1FG256I M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip

M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip

M1AFS1500-1FG256I ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS1500-1FG256K M1AFS1500-1FG256I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $627,13 $205,00
Manufacturer Microchip Technology —
Family Fusion (Mixed-Signal Flash FPGA) —
System Gates 1500000 —
Logic Cells 38400 —
Number of I/O 119 —
Flash Memory 276480 bits —
Processor Core ARM Cortex-M1 (soft core) ARM Cortex-M1 (M1 variant)
Speed Grade -1 -1 (standard)
Gehäuse 256-LBGA (FG256) 256-LBGA (FG256)
Montageart Surface Mount Surface Mount
Configuration Technology Flash (instant-on, single-chip) Flash-based, nonvolatile
Analog Features Configurable analog blocks (Fusion mixed-signal) —
Programmability In-System Programmable —
RoHS-Status RoHS Non-Compliant Non-Compliant (contains lead, per distributor data)
Lead Free Status Contains Lead —
Betriebstemperatur [DATA_NEEDED: operating temperature range] -40C to +85C (industrial grade, suffix I)
Core Supply Voltage [DATA_NEEDED: core supply voltage] 1.5 V
Embedded Memory Blocks [DATA_NEEDED: SRAM block size] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Logic Capacity — 1,500,000 system gates
User I/O — 119
Memory Resource — 276480 bits
Process Technology — 130 nm CMOS, 7-layer metal
System Performance — up to 350 MHz
Power-Up Behavior — Live at Power-Up (LAPU)
Analog Functionality — Fusion configurable analog blocks
Clock Management — Integrated clock generation and management circuitry
Lead-Free Status — Contains Lead

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern