M1AFS1500-1FG676I vs M1AFS1500-2FG676I Comparación
Comparación detallada lado a lado de M1AFS1500-1FG676I por Microchip Technology y M1AFS1500-2FG676I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip
M1AFS1500-1FG676I ✓ ActivoMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-1FG676I | M1AFS1500-2FG676I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $340,59 | $405,00 |
| Manufacturer Part Number | M1AFS1500-1FG676I | — |
| Manufacturer | Microchip Technology (Microsemi) | — |
| Product Type | Fusion Mixed-Signal FPGA | — |
| Number of Gates | 1.5 M | — |
| Number of I/O | 252 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Speed Grade | -1 | 2 |
| Encapsulado / Carcasa | 676-Pin FBGA | — |
| Estilo de montaje | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 Hours) | — |
| Peak Reflow Time | 30 s | — |
| Packaging | Tray | — |
| Estado RoHS | RoHS Non-Compliant | RoHS Non-Compliant (contains lead) |
| Lead Free Status | Contains Lead | Contains Lead |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | — | 1.5 M |
| Encapsulado | — | 676-ball FBGA (FG676) |
| Tipo de montaje | — | Surface Mount |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Rango de temperatura de funcionamiento | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |