M1AFS1500-1FG676I vs M1AFS1500-2FG676I 对比

详细并排对比 M1AFS1500-1FG676I 出自 Microchip Technology 和 M1AFS1500-2FG676I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M1AFS1500-1FG676I M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip

M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip

M1AFS1500-1FG676I ✓ 量产中
Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ 量产中

规格对比

参数 M1AFS1500-1FG676I M1AFS1500-2FG676I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $340.59 $405.00
Manufacturer Part Number M1AFS1500-1FG676I —
Manufacturer Microchip Technology (Microsemi) —
Product Type Fusion Mixed-Signal FPGA —
Number of Gates 1.5 M —
Number of I/O 252 —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm CMOS 130 nm CMOS
Speed Grade -1 2
封装 / 外壳 676-Pin FBGA —
安装方式 SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
湿敏等级(MSL) 3 (168 Hours) —
Peak Reflow Time 30 s —
Packaging Tray —
RoHS 状态 RoHS Non-Compliant RoHS Non-Compliant (contains lead)
Lead Free Status Contains Lead Contains Lead
Family — Fusion (Mixed-Signal Flash FPGA)
System Gates — 1.5 M
封装 — 676-ball FBGA (FG676)
安装类型 — Surface Mount
Configuration Memory — On-chip flash (non-volatile, instant-on)
工作温度范围 — Industrial (I suffix) -40C to +100C
Embedded Analog Features — On-chip ADC, clock conditioning circuit (CCC), power-on reset
External Configuration Device — Not required
Packaging Method — Tray
Number of User I/O — [DATA_NEEDED: Number of User I/O]
Embedded SRAM — [DATA_NEEDED: Embedded SRAM capacity]
DLL/PLL Blocks — [DATA_NEEDED: Number of CCC blocks]

数据手册与资源

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