M1AFS1500-2FGG256 vs M1AFS1500-1FGG256I Comparación
Comparación detallada lado a lado de M1AFS1500-2FGG256 por Microchip Technology y M1AFS1500-1FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ ActivoMicrochip Technology
M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-2FGG256 | M1AFS1500-1FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $124,50 | $136,90 |
| Series | M1AFS1500 (Fusion) | — |
| System Gates | 1,500,000 | 1.5 million |
| Logic Cells | 38,400 | 38400 |
| Embedded Processor | ARM Cortex-M1 | — |
| Frecuencia de reloj máxima | 350 MHz | — |
| Number of I/O | 119 | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Flash Memory Bits (reported) | 276480 | — |
| Technology | CMOS, 130nm class | — |
| Speed Grade | -2 | -1 (standard) |
| Encapsulado / Carcasa | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Estilo de montaje | SMD/SMT | — |
| Rango de temperatura de funcionamiento | 0C to +70C | — |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) | — |
| Programming Type | Flash-based (in-system programmable) | — |
| Packaging | Tray | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Blocks | [DATA_NEEDED: RAM block count] | — |
| Family | — | Fusion (M1 series, mixed-signal FPGA) |
| Processor Core | — | ARM Cortex-M1 (soft core in fabric) |
| User I/O | — | 119 |
| Flash Configuration Memory | — | 276480 bits |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash-based |
| Encapsulado | — | 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch |
| Temperatura de funcionamiento | — | -40C to +85C (industrial, I suffix) |
| Configuration Type | — | Flash-based, instant-on, single chip |
| Security | — | 128-bit flash lock, AES decryption |
| Analog Features | — | Configurable analog blocks (mixed-signal) |
| Clock Management | — | Integrated CCC (clock conditioning circuits) |
| Tipo de montaje | — | Surface Mount |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |