M1AFS1500-2FGG256 vs M1AFS1500-2FG256I Comparación
Comparación detallada lado a lado de M1AFS1500-2FGG256 por Microchip Technology y M1AFS1500-2FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ ActivoMicrochip Technology
M1AFS1500-2FG256I - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-2FGG256 | M1AFS1500-2FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $124,50 | $152,00 |
| Series | M1AFS1500 (Fusion) | — |
| System Gates | 1,500,000 | 1500000 |
| Logic Cells | 38,400 | 38400 |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 (M1 variant) |
| Frecuencia de reloj máxima | 350 MHz | — |
| Number of I/O | 119 | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Flash Memory Bits (reported) | 276480 | — |
| Technology | CMOS, 130nm class | — |
| Speed Grade | -2 | -2 |
| Encapsulado / Carcasa | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Estilo de montaje | SMD/SMT | — |
| Rango de temperatura de funcionamiento | 0C to +70C | — |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) | — |
| Programming Type | Flash-based (in-system programmable) | — |
| Packaging | Tray | Tray |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Blocks | [DATA_NEEDED: RAM block count] | — |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm Flash-based CMOS |
| Configuration Memory | — | On-chip Flash (non-volatile, secure) |
| Encapsulado | — | 256-ball FBGA (LBGA) |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Estado RoHS | — | Compliant |
| Lead Free | — | Yes |
| Analog Subsystem | — | Mixed-signal FPGA with configurable analog blocks and ADC |
| Clock Management | — | Integrated clock generation and management circuitry |