M1AFS1500-FG256K vs M1AFS1500-1FGG256 Comparación
Comparación detallada lado a lado de M1AFS1500-FG256K por Microchip Technology y M1AFS1500-1FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-FG256K ✓ ActivoMicrochip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-FG256K | M1AFS1500-1FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $341,46 | $172,23 |
| Family | Fusion (M1 - ARM Cortex-M1 enabled) | — |
| System Gates | 1500000 | 1,500,000 |
| Flash Memory Cells | 276480 | — |
| User I/O | 119 | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 |
| Tensión de alimentación | 1.425 V to 1.575 V | 1.5 V |
| Core Process Technology | 130 nm flash | — |
| Encapsulado | 256-LBGA (FBGA/FG256) | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range for FG256K suffix] | — |
| Packaging | Tray | Tray |
| Configuration Memory | On-chip flash (live at power-up) | Flash-based (non-volatile) |
| Analog Peripherals | Integrated configurable analog blocks | — |
| Clock Management | Integrated clock generation and management circuitry | Integrated clock generation and management circuitry |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Speed Grade | Standard (no dash letter suffix) | -1 |
| Series | — | Fusion (M1AFS1500) |
| Logic Cells | — | 38,400 |
| Frecuencia de reloj máxima | — | 350 MHz |
| Number of I/Os | — | 119 |
| Technology | — | CMOS, 130 nm |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Estilo de montaje | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Integrated Analog Blocks | — | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | — | Yes |