M1AFS1500-FG256K vs M1AFS1500-1FGG256 Comparaison
Comparaison détaillée côte à côte de M1AFS1500-FG256K par Microchip Technology et M1AFS1500-1FGG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-FG256K ✓ ActifMicrochip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-FG256K | M1AFS1500-1FGG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $341,46 | $172,23 |
| Family | Fusion (M1 - ARM Cortex-M1 enabled) | — |
| System Gates | 1500000 | 1,500,000 |
| Flash Memory Cells | 276480 | — |
| User I/O | 119 | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 |
| Tension d'alimentation | 1.425 V to 1.575 V | 1.5 V |
| Core Process Technology | 130 nm flash | — |
| Boîtier | 256-LBGA (FBGA/FG256) | — |
| Type de montage | Surface Mount | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range for FG256K suffix] | — |
| Packaging | Tray | Tray |
| Configuration Memory | On-chip flash (live at power-up) | Flash-based (non-volatile) |
| Analog Peripherals | Integrated configurable analog blocks | — |
| Clock Management | Integrated clock generation and management circuitry | Integrated clock generation and management circuitry |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Speed Grade | Standard (no dash letter suffix) | -1 |
| Series | — | Fusion (M1AFS1500) |
| Logic Cells | — | 38,400 |
| Fréquence d'horloge maximale | — | 350 MHz |
| Number of I/Os | — | 119 |
| Technology | — | CMOS, 130 nm |
| Boîtier / Format | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Style de montage | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Integrated Analog Blocks | — | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | — | Yes |