M1AFS1500-FGG676 vs M1AFS1500-1FGG676 Comparación
Comparación detallada lado a lado de M1AFS1500-FGG676 por Microchip Technology y M1AFS1500-1FGG676 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-FGG676 - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-FGG676 ✓ ActivoMicrochip Technology
M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip
M1AFS1500-1FGG676 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-FGG676 | M1AFS1500-1FGG676 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $0,00 |
| Family | Fusion (M1 Fusion mixed-signal FPGA) | — |
| Equivalent Gates | 1,500,000 gates | — |
| Logic Cells | 38,400 | — |
| User I/O | 252 | — |
| Max Clock Frequency | 350 MHz | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Process Technology | 130 nm CMOS | — |
| Configuration Technology | Flash-based (instant-on, live at power-up) | — |
| Security | 128-bit flash lock, AES decryption | — |
| Analog Capability | Configurable analog blocks, voltage/temperature monitoring | — |
| Soft CPU Support | ARM Cortex-M1, MicroBlade | — |
| Encapsulado | 676-ball FBGA (FGG676) | — |
| Tipo de montaje | Surface Mount | — |
| Packaging | Tray | Tray |
| Estado RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Embedded Memory | Large flash memory blocks integrated | — |
| Manufacturer Part Number | — | M1AFS1500-1FGG676 |
| Series | — | M1AFS1500 (Fusion) |
| Number of Equivalent Gates | — | 1,500,000 gates |
| Number of Logic Cells | — | 38,400 |
| Frecuencia de reloj máxima | — | 350 MHz |
| Number of I/O | — | 252 I/O |
| Technology | — | 130 nm CMOS flash-based |
| Encapsulado / Carcasa | — | FBGA-676 (676-ball BGA, 1.00 mm ball pitch) |
| Estilo de montaje | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Speed Grade | — | -1 |
| Configuration Memory | — | Flash (non-volatile, live at power-up) |
| Analog Integration | — | Configurable analog blocks (mixed-signal Fusion architecture) |