M1AFS1500-FGG676 vs M1AFS1500-1FGG676 Comparaison
Comparaison détaillée côte à côte de M1AFS1500-FGG676 par Microchip Technology et M1AFS1500-1FGG676 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-FGG676 - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-FGG676 ✓ ActifMicrochip Technology
M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip
M1AFS1500-1FGG676 ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-FGG676 | M1AFS1500-1FGG676 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $0,00 |
| Family | Fusion (M1 Fusion mixed-signal FPGA) | — |
| Equivalent Gates | 1,500,000 gates | — |
| Logic Cells | 38,400 | — |
| User I/O | 252 | — |
| Max Clock Frequency | 350 MHz | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Process Technology | 130 nm CMOS | — |
| Configuration Technology | Flash-based (instant-on, live at power-up) | — |
| Security | 128-bit flash lock, AES decryption | — |
| Analog Capability | Configurable analog blocks, voltage/temperature monitoring | — |
| Soft CPU Support | ARM Cortex-M1, MicroBlade | — |
| Boîtier | 676-ball FBGA (FGG676) | — |
| Type de montage | Surface Mount | — |
| Packaging | Tray | Tray |
| Statut RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Embedded Memory | Large flash memory blocks integrated | — |
| Manufacturer Part Number | — | M1AFS1500-1FGG676 |
| Series | — | M1AFS1500 (Fusion) |
| Number of Equivalent Gates | — | 1,500,000 gates |
| Number of Logic Cells | — | 38,400 |
| Fréquence d'horloge maximale | — | 350 MHz |
| Number of I/O | — | 252 I/O |
| Technology | — | 130 nm CMOS flash-based |
| Boîtier / Format | — | FBGA-676 (676-ball BGA, 1.00 mm ball pitch) |
| Style de montage | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Speed Grade | — | -1 |
| Configuration Memory | — | Flash (non-volatile, live at power-up) |
| Analog Integration | — | Configurable analog blocks (mixed-signal Fusion architecture) |