M1AFS250-FG256 vs M1AFS250-1FG256I Comparación
Comparación detallada lado a lado de M1AFS250-FG256 por Microchip Technology y M1AFS250-1FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-FG256 ✓ ActivoMicrochip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS250-FG256 | M1AFS250-1FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $112,00 | $96,50 |
| Manufacturer Part Number | M1AFS250-FG256 | — |
| Family | Fusion (M1 series, ARM Cortex-M1) | — |
| System Gates | 250000 | 250000 gates |
| Logic Cells | 6144 | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 soft core |
| Frecuencia de reloj máxima | 350 MHz | — |
| Number of I/O | 114 | — |
| RAM Bits | 36864 | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V to 1.575 V) |
| Configuration Memory | Flash (nonvolatile) | — |
| Rango de temperatura de funcionamiento | 0C to +70C | — |
| Encapsulado / Carcasa | 256-FBGA (256-LBGA), 1.00 mm pitch | — |
| Estilo de montaje | SMD/SMT | — |
| Packaging | Tray | — |
| Estado RoHS | RoHS Non-Compliant (contains lead) | — |
| Lead Free Status | Contains Lead | — |
| Series | M1AFS250 | Fusion (M1 - with ARM Cortex-M1) |
| D Flip-Flops (DFF) | — | 36864 |
| Total I/O | — | 114 |
| Configuration Type | — | Flash-based (live at power-up) |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| On-chip Memory | — | Flash memory blocks |
| Temperatura de funcionamiento | — | -40C to +85C (industrial, suffix I) |
| Speed Grade | — | -1 |
| Encapsulado | — | 256-LBGA (FBGA) |
| Package Dimensions | — | 17 mm x 17 mm x 1.2 mm height |
| Tipo de montaje | — | Surface Mount |
| Supplier Device Package | — | 256-LBGA |
| Total RAM | — | [DATA_NEEDED: Total RAM bits] |
| Embedded Block RAM (eSRAM) | — | [DATA_NEEDED: eSRAM size] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |