M1AFS250-FGG256 vs M1AFS250-2FGG256I Comparación
Comparación detallada lado a lado de M1AFS250-FGG256 por Microchip Technology y M1AFS250-2FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS250-FGG256 ✓ ActivoMicrochip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS250-FGG256 | M1AFS250-2FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $88,00 | $83,12 |
| Family | Fusion (M1 series, mixed-signal FPGA) | Actel Fusion (Mixed-Signal FPGA) |
| System Gates | 250,000 | 250000 gates |
| Logic Cells | 6144 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 (M1 variants) | ARM Cortex-M1 |
| Frecuencia de reloj máxima | 350 MHz | — |
| Configuration Memory | Flash-based, live at power-up | — |
| Flash Memory Bits | 36864 | — |
| Technology | CMOS | — |
| Encapsulado | 256-LBGA (FGG256), 1.0 mm ball pitch | 256-ball FBGA (FGG256) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | RoHS Compliant | Compliant (FGG = Pb-free balls) |
| Lead Free Status | Lead Free | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial, I grade) |
| Tensión de alimentación | [DATA_NEEDED: core supply voltage] | — |
| Analog Peripherals | Configurable analog (voltage/temperature monitoring) | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| Registers (DFFs) | — | 36864 |
| User I/Os | — | 114 |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm, 7-layer metal CMOS |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -2 |
| Core Supply Voltage | — | 1.5 V |
| Security | — | 128-bit Flash lock, AES decryption |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |