M1AFS250-FGG256 vs M1AFS250-2FGG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-FGG256 par Microchip Technology et M1AFS250-2FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS250-FGG256 ✓ ActifMicrochip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-FGG256 | M1AFS250-2FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $88,00 | $83,12 |
| Family | Fusion (M1 series, mixed-signal FPGA) | Actel Fusion (Mixed-Signal FPGA) |
| System Gates | 250,000 | 250000 gates |
| Logic Cells | 6144 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 (M1 variants) | ARM Cortex-M1 |
| Fréquence d'horloge maximale | 350 MHz | — |
| Configuration Memory | Flash-based, live at power-up | — |
| Flash Memory Bits | 36864 | — |
| Technology | CMOS | — |
| Boîtier | 256-LBGA (FGG256), 1.0 mm ball pitch | 256-ball FBGA (FGG256) |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | RoHS Compliant | Compliant (FGG = Pb-free balls) |
| Lead Free Status | Lead Free | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial, I grade) |
| Tension d'alimentation | [DATA_NEEDED: core supply voltage] | — |
| Analog Peripherals | Configurable analog (voltage/temperature monitoring) | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| Registers (DFFs) | — | 36864 |
| User I/Os | — | 114 |
| Configuration Technology | — | Flash-based, nonvolatile |
| Process Technology | — | 130 nm, 7-layer metal CMOS |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -2 |
| Core Supply Voltage | — | 1.5 V |
| Security | — | 128-bit Flash lock, AES decryption |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |