M1AFS250-FGG256I vs A3PE600-FGG256I Comparación
Comparación detallada lado a lado de M1AFS250-FGG256I por Microchip Technology y A3PE600-FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip
M1AFS250-FGG256I ✓ ActivoMicrochip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS250-FGG256I | A3PE600-FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $49,50 | $41,80 |
| Series | Fusion (M1AFS) | — |
| System Gates | 250K | 600000 gates |
| D Flip-Flops / Registers | 36864 | — |
| User I/O | 114 | 165 |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Fabric Speed Metric | 1.0989 GHz (per distributor listing) | — |
| Process Technology | 130 nm flash-based | CMOS flash FPGA |
| Configuration Memory | On-chip flash (non-volatile) | On-chip Flash (non-volatile, single-chip) |
| Encapsulado | 256-LBGA (FGG256) | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Estado RoHS | Compliant | Compliant (lead free) |
| Packaging | Tray | — |
| Family | — | ProASIC3E Flash FPGA |
| Logic Elements (VersaTiles) | — | 13824 |
| Embedded Flash Memory | — | 110592 bits |
| Maximum Internal Performance | — | 350 MHz |
| Package Height | — | 1.6 mm |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible packages |