M1AFS600-2FGG256 vs M1AFS600-2FG256 Comparación
Comparación detallada lado a lado de M1AFS600-2FGG256 por Microchip Technology y M1AFS600-2FG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS600-2FGG256 - Fusion 600K-Gate Mixed-Signal FPGA | Microchip
M1AFS600-2FGG256 ✓ ActivoMicrochip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS600-2FGG256 | M1AFS600-2FG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $46,75 |
| Family | Fusion (M1) Mixed-Signal FPGA | — |
| System Gates | 600K | 600000 gates |
| User I/O | 119 | — |
| Programmable Resources (DigiKey listing) | 110592 | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum Frequency | 1470.59 MHz | — |
| Configuration Technology | Flash-based (non-volatile) | — |
| Encapsulado | 256-LBGA (FBGA / FG256) | — |
| Tipo de montaje | Surface Mount | — |
| Analog Peripherals | Integrated configurable analog subsystem | Configurable analog block (Fusion mixed-signal) |
| On-chip Memory | Large flash memory blocks | Large flash memory blocks |
| Clock Management | On-chip clock generation and management circuitry | On-chip clock generation and management (PLL) |
| Temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O Supply Voltage] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Series | — | M1AFS600 (Fusion) |
| Logic Elements | — | 110592 |
| Embedded Processor | — | ARM Cortex-M1 |
| Number of I/Os | — | 119 I/O |
| Technology | — | 130 nm flash-based |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA-256) |
| Estilo de montaje | — | SMD/SMT |
| Operating Temperature - Minimum | — | 0 C |
| Operating Temperature - Maximum | — | +70 C |
| Packaging | — | Tray |
| Configuration | — | Flash-based, live at power-up, no external config PROM required |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum fabric operating frequency] |