M1AFS600-2FGG256 vs M1AFS600-2FG256 Comparaison
Comparaison détaillée côte à côte de M1AFS600-2FGG256 par Microchip Technology et M1AFS600-2FG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS600-2FGG256 - Fusion 600K-Gate Mixed-Signal FPGA | Microchip
M1AFS600-2FGG256 ✓ ActifMicrochip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ ActifComparaison des spécifications
| Paramètre | M1AFS600-2FGG256 | M1AFS600-2FG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $46,75 |
| Family | Fusion (M1) Mixed-Signal FPGA | — |
| System Gates | 600K | 600000 gates |
| User I/O | 119 | — |
| Programmable Resources (DigiKey listing) | 110592 | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum Frequency | 1470.59 MHz | — |
| Configuration Technology | Flash-based (non-volatile) | — |
| Boîtier | 256-LBGA (FBGA / FG256) | — |
| Type de montage | Surface Mount | — |
| Analog Peripherals | Integrated configurable analog subsystem | Configurable analog block (Fusion mixed-signal) |
| On-chip Memory | Large flash memory blocks | Large flash memory blocks |
| Clock Management | On-chip clock generation and management circuitry | On-chip clock generation and management (PLL) |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O Supply Voltage] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Series | — | M1AFS600 (Fusion) |
| Logic Elements | — | 110592 |
| Embedded Processor | — | ARM Cortex-M1 |
| Number of I/Os | — | 119 I/O |
| Technology | — | 130 nm flash-based |
| Boîtier / Format | — | 256-LBGA (FBGA-256) |
| Style de montage | — | SMD/SMT |
| Operating Temperature - Minimum | — | 0 C |
| Operating Temperature - Maximum | — | +70 C |
| Packaging | — | Tray |
| Configuration | — | Flash-based, live at power-up, no external config PROM required |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum fabric operating frequency] |