M7AFS600-1FGG256 vs M7AFS600-FG256I Comparación
Comparación detallada lado a lado de M7AFS600-1FGG256 por Microchip Technology y M7AFS600-FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-1FGG256 NrndMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ ActivoComparación de especificaciones
| Parámetro | M7AFS600-1FGG256 | M7AFS600-FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $92,00 | $0,00 |
| Family | Fusion (Mixed-Signal FPGA) | — |
| System Gates | 600K | 600K |
| Fabric Elements (Registers) | 110592 | — |
| Embedded Processor | 32-bit ARM CoreMP7 (hard core) | ARM CoreMP7 |
| Speed Grade | -1 | — |
| Process Technology | 130 nm flash | 130 nm |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Encapsulado | 256-LBGA (FPBGA-256, 17x17 mm) | — |
| Tipo de montaje | Surface Mount | — |
| Configuration | Flash-based, nonvolatile, live at power-up | — |
| Temperatura de funcionamiento | 0C to +70C (commercial) | — |
| Maximum Frequency | [DATA_NEEDED: maximum fabric/system frequency] | — |
| Number of I/O | [DATA_NEEDED: user I/O count for FGG256] | 119 I/O |
| Analog Peripherals | [DATA_NEEDED: ADC channel count and resolution] | — |
| On-chip RTC / POR | [DATA_NEEDED: RTC/POR availability details] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Estilo de montaje | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |