M7AFS600-1FGG256 vs M7AFS600-FG256I Comparaison
Comparaison détaillée côte à côte de M7AFS600-1FGG256 par Microchip Technology et M7AFS600-FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-1FGG256 NrndMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ ActifComparaison des spécifications
| Paramètre | M7AFS600-1FGG256 | M7AFS600-FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $92,00 | $0,00 |
| Family | Fusion (Mixed-Signal FPGA) | — |
| System Gates | 600K | 600K |
| Fabric Elements (Registers) | 110592 | — |
| Embedded Processor | 32-bit ARM CoreMP7 (hard core) | ARM CoreMP7 |
| Speed Grade | -1 | — |
| Process Technology | 130 nm flash | 130 nm |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Boîtier | 256-LBGA (FPBGA-256, 17x17 mm) | — |
| Type de montage | Surface Mount | — |
| Configuration | Flash-based, nonvolatile, live at power-up | — |
| Température de fonctionnement | 0C to +70C (commercial) | — |
| Maximum Frequency | [DATA_NEEDED: maximum fabric/system frequency] | — |
| Number of I/O | [DATA_NEEDED: user I/O count for FGG256] | 119 I/O |
| Analog Peripherals | [DATA_NEEDED: ADC channel count and resolution] | — |
| On-chip RTC / POR | [DATA_NEEDED: RTC/POR availability details] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Boîtier / Format | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Style de montage | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |