M7AFS600-1FGG256I vs M7AFS600-1FGG256 Comparación
Comparación detallada lado a lado de M7AFS600-1FGG256I por Microchip Technology y M7AFS600-1FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ ActivoMicrochip Technology
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-1FGG256 NrndComparación de especificaciones
| Parámetro | M7AFS600-1FGG256I | M7AFS600-1FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $92,00 |
| Family | Fusion (Mixed-Signal Flash FPGA) | Fusion (Mixed-Signal FPGA) |
| System Gates | 600K | 600K |
| Processor Core | ARM CoreMP7 | — |
| Number of I/O | 119 | [DATA_NEEDED: user I/O count for FGG256] |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | 130 nm flash |
| Configuration Memory | Flash (nonvolatile) | — |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -1 | -1 |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Encapsulado / Carcasa | 256-Ball FBGA (FGG256) | — |
| Estilo de montaje | SMD/SMT | — |
| Packaging | Tray | — |
| Series | M7AFS600 | — |
| Live at Power-Up (LAPU) | Yes | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) | — |
| Fabric Elements (Registers) | — | 110592 |
| Embedded Processor | — | 32-bit ARM CoreMP7 (hard core) |
| Core Supply Voltage | — | 1.5 V |
| Encapsulado | — | 256-LBGA (FPBGA-256, 17x17 mm) |
| Tipo de montaje | — | Surface Mount |
| Configuration | — | Flash-based, nonvolatile, live at power-up |
| Temperatura de funcionamiento | — | 0C to +70C (commercial) |
| Maximum Frequency | — | [DATA_NEEDED: maximum fabric/system frequency] |
| Analog Peripherals | — | [DATA_NEEDED: ADC channel count and resolution] |
| On-chip RTC / POR | — | [DATA_NEEDED: RTC/POR availability details] |
| Nivel MSL | — | [DATA_NEEDED: moisture sensitivity level] |