M7AFS600-1FGG256I vs M7AFS600-1FGG256 Comparaison
Comparaison détaillée côte à côte de M7AFS600-1FGG256I par Microchip Technology et M7AFS600-1FGG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ ActifMicrochip Technology
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-1FGG256 NrndComparaison des spécifications
| Paramètre | M7AFS600-1FGG256I | M7AFS600-1FGG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $92,00 |
| Family | Fusion (Mixed-Signal Flash FPGA) | Fusion (Mixed-Signal FPGA) |
| System Gates | 600K | 600K |
| Processor Core | ARM CoreMP7 | — |
| Number of I/O | 119 | [DATA_NEEDED: user I/O count for FGG256] |
| Tension d'alimentation de fonctionnement | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | 130 nm flash |
| Configuration Memory | Flash (nonvolatile) | — |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -1 | -1 |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Boîtier / Format | 256-Ball FBGA (FGG256) | — |
| Style de montage | SMD/SMT | — |
| Packaging | Tray | — |
| Series | M7AFS600 | — |
| Live at Power-Up (LAPU) | Yes | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) | — |
| Fabric Elements (Registers) | — | 110592 |
| Embedded Processor | — | 32-bit ARM CoreMP7 (hard core) |
| Core Supply Voltage | — | 1.5 V |
| Boîtier | — | 256-LBGA (FPBGA-256, 17x17 mm) |
| Type de montage | — | Surface Mount |
| Configuration | — | Flash-based, nonvolatile, live at power-up |
| Température de fonctionnement | — | 0C to +70C (commercial) |
| Maximum Frequency | — | [DATA_NEEDED: maximum fabric/system frequency] |
| Analog Peripherals | — | [DATA_NEEDED: ADC channel count and resolution] |
| On-chip RTC / POR | — | [DATA_NEEDED: RTC/POR availability details] |
| Niveau MSL | — | [DATA_NEEDED: moisture sensitivity level] |