M7AFS600-1FGG484I vs M7AFS600-FGG484 Comparación
Comparación detallada lado a lado de M7AFS600-1FGG484I por Microchip Technology y M7AFS600-FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip
M7AFS600-1FGG484I ✓ ActivoMicrochip Technology
M7AFS600-FGG484 - 600K Gate Fusion FPGA, 484-BGA | Microchip
M7AFS600-FGG484 ✓ ActivoComparación de especificaciones
| Parámetro | M7AFS600-1FGG484I | M7AFS600-FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $228,00 | $232,90 |
| Series | Fusion (M7AFS600) | — |
| System Gates | 600000 | 600 K |
| Number of I/Os | 172 | — |
| Total RAM Bits | 110592 | 110592 (per DigiKey listing) |
| Embedded Processor | ARM CoreMP7 | ARM CoreMP7 (hard core) |
| Tensión de alimentación | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Maximum Operating Frequency | 1282.05 MHz | 1098.9 MHz (distributor-listed) |
| Process Technology | 130 nm | — |
| Speed Grade | 1 (M7, fastest family grade) | — |
| Temperatura de funcionamiento | -40C to +85C | [DATA_NEEDED: operating temperature range for commercial grade] |
| Encapsulado / Carcasa | 484-BGA (FBGA) | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Estilo de montaje | SMD/SMT | — |
| Packaging | Tray | Tray |
| Programmable Type | Flash-based, In-System Programmable | — |
| Estado RoHS | ROHS3 Compliant | Compliant (Pb-free balls, FGG suffix) |
| Manufacturer Lead Time | 16 weeks | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Number of Logic Cells | [DATA_NEEDED: logic cell count] | — |
| Family | — | Fusion (Mixed-Signal FPGA) |
| Technology | — | 130 nm flash-based |
| Core Voltage | — | 1.5 V |
| User I/O | — | 172 |
| Configuration Memory | — | Flash (non-volatile, secure) |
| Encapsulado | — | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm |
| Ball Pitch | — | 1 mm |
| Tipo de montaje | — | Surface Mount |
| Number of Logic Blocks | — | [DATA_NEEDED: logic block count] |