MC34912BAC vs MC33912BAC Comparación
Comparación detallada lado a lado de MC34912BAC por NXP Semiconductors y MC33912BAC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC34912BAC - LIN System Basis Chip with DC Motor Pre-Driver | NXP
MC34912BAC ObsoleteNXP Semiconductors
MC33912BAC - LIN SBC with DC Motor Pre-Driver | NXP Semiconductors
MC33912BAC ✗ Fin de vidaComparación de especificaciones
| Parámetro | MC34912BAC | MC33912BAC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Voltage Regulators | Voltage Regulators |
| Estado del ciclo de vida | Obsolete | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,10 | $3,35 |
| Función | LIN System Basis Chip with DC Motor Pre-Driver and Current Sense | LIN System Basis Chip (SBC) with DC motor pre-driver and current sense |
| Interfaz | SPI (Serial Peripheral Interface) | — |
| LIN Transceiver | Yes (LIN physical layer, ISO 9141 / SAE J2602) | — |
| Number of LDOs | 2 x 5.0 V low-dropout regulators | — |
| Primary LDO Output | 5.0 V / 60 mA | — |
| Secondary LDO Output | 5.0 V / 20 mA | — |
| Supply Voltage Range | 5.5 V to 18 V | 5.5 V to 27 V |
| Supply Current (typical) | 4.5 mA | — |
| DC Motor Pre-Driver | Yes (low-side / H-bridge pre-driver) | Low-side pre-driver for H-bridge control |
| Current Sense Amplifier | Yes (internal) | Integrated, adjustable gain, SPI-readable |
| Watchdog | Selectable timing window via SPI | Selectable window watchdog |
| ESD Protection (LIN pin, contact) | +/-6.0 kV minimum (IEC 61000-4-2 gun test, 150 pF / 330 ohm) | — |
| ISO 7637 Pulse 3b Immunity | Yes | — |
| Temperatura de funcionamiento | [DATA_NEEDED: temperature grade] | -40C to +125C (automotive grade) |
| Encapsulado | 32-LQFP (7x7 mm) | 32-pin LQFP (exposed pad) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Lead-Free / RoHS | Per NXP product page | — |
| Communication Interface | — | SPI (configuration/diagnostics), LIN 2.0/2.1 (physical layer) |
| Integrated LDO Output | — | 5.0 V / 50 mA |
| Current Consumption (typical) | — | 4.5 mA |
| Relay Drivers | — | 2 x low-side, 1.5 ohm typical RDSon |
| LIN Bus Compliance | — | LIN 2.0 / LIN 2.1 / ISO 9141 physical layer |
| ESD Performance (LIN pin) | — | IEC 61000-4-2, +/-6 kV min (gun test, 150 pF / 330 ohm) |
| ISO Pulse Immunity | — | ISO 7637 pulse 3b compliant |
| Estado RoHS | — | Compliant |