MC34912BAC vs MC33912BAC Comparaison
Comparaison détaillée côte à côte de MC34912BAC par NXP Semiconductors et MC33912BAC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC34912BAC - LIN System Basis Chip with DC Motor Pre-Driver | NXP
MC34912BAC ObsoleteNXP Semiconductors
MC33912BAC - LIN SBC with DC Motor Pre-Driver | NXP Semiconductors
MC33912BAC ✗ Fin de vieComparaison des spécifications
| Paramètre | MC34912BAC | MC33912BAC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Voltage Regulators | Voltage Regulators |
| Statut du cycle de vie | Obsolete | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2,10 | $3,35 |
| Fonction | LIN System Basis Chip with DC Motor Pre-Driver and Current Sense | LIN System Basis Chip (SBC) with DC motor pre-driver and current sense |
| Interface | SPI (Serial Peripheral Interface) | — |
| LIN Transceiver | Yes (LIN physical layer, ISO 9141 / SAE J2602) | — |
| Number of LDOs | 2 x 5.0 V low-dropout regulators | — |
| Primary LDO Output | 5.0 V / 60 mA | — |
| Secondary LDO Output | 5.0 V / 20 mA | — |
| Supply Voltage Range | 5.5 V to 18 V | 5.5 V to 27 V |
| Supply Current (typical) | 4.5 mA | — |
| DC Motor Pre-Driver | Yes (low-side / H-bridge pre-driver) | Low-side pre-driver for H-bridge control |
| Current Sense Amplifier | Yes (internal) | Integrated, adjustable gain, SPI-readable |
| Watchdog | Selectable timing window via SPI | Selectable window watchdog |
| ESD Protection (LIN pin, contact) | +/-6.0 kV minimum (IEC 61000-4-2 gun test, 150 pF / 330 ohm) | — |
| ISO 7637 Pulse 3b Immunity | Yes | — |
| Température de fonctionnement | [DATA_NEEDED: temperature grade] | -40C to +125C (automotive grade) |
| Boîtier | 32-LQFP (7x7 mm) | 32-pin LQFP (exposed pad) |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Lead-Free / RoHS | Per NXP product page | — |
| Communication Interface | — | SPI (configuration/diagnostics), LIN 2.0/2.1 (physical layer) |
| Integrated LDO Output | — | 5.0 V / 50 mA |
| Current Consumption (typical) | — | 4.5 mA |
| Relay Drivers | — | 2 x low-side, 1.5 ohm typical RDSon |
| LIN Bus Compliance | — | LIN 2.0 / LIN 2.1 / ISO 9141 physical layer |
| ESD Performance (LIN pin) | — | IEC 61000-4-2, +/-6 kV min (gun test, 150 pF / 330 ohm) |
| ISO Pulse Immunity | — | ISO 7637 pulse 3b compliant |
| Statut RoHS | — | Compliant |