MC56F8357MPYE vs MC56F8367MPYE Comparación
Comparación detallada lado a lado de MC56F8357MPYE por NXP Semiconductors y MC56F8367MPYE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC56F8357MPYE - 16-bit DSC, 56800E Core, 256KB Flash, 60MHz
MC56F8357MPYE ✓ ActivoNXP Semiconductors
MC56F8367MPYE - 16-bit 60MHz DSC 512KB Flash LQFP-160 | NXP
MC56F8367MPYE ✓ ActivoComparación de especificaciones
| Parámetro | MC56F8357MPYE | MC56F8367MPYE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,80 | $17,10 |
| Core | 56800E (16-bit hybrid DSC core) | 56800E (16-bit DSC) |
| Ancho del bus de datos | 16 bit | — |
| Instruction Set | C-efficient 56800E unified instruction set | — |
| Maximum Core Frequency | 60 MHz | 60 MHz |
| Performance | 60 MIPS | — |
| Program Memory | 256 KB (128K x 16) Flash | 512 KB (256K x 16) Flash |
| Data Memory | [DATA_NEEDED: RAM size in KB] | [DATA_NEEDED: RAM size in KB] |
| Tensión de alimentación | 3.3 V | — |
| Encapsulado | 160-LQFP (24 x 24 mm) | 160-LQFP (24x24 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: industrial -40C to +105C or -40C to +125C] | — |
| ADC | Dual 12-bit ADC (peripherals integrated) | Dual 12-bit ADC |
| PWM Modules | Yes (suitable for 3-phase motor drive) | Yes, with ADC synchronization |
| Communication Peripherals | SCI, SPI, I2C, CAN | — |
| Quadrature Decoder | Yes | On 56F8167 variant (2 channels) |
| Timers | Multiple general-purpose timers | — |
| Debug Interface | JTAG/OnCE | JTAG / OnCE |
| Family | 56F835X / 56F815X (56800E DSC) | — |
| Estado RoHS | Compliant (details per distributor page) | Compliant |
| Core Architecture | — | Hybrid DSP/MCU, Harvard bus |
| Operating Voltage | — | 3.3 V (typical) |
| Communication | — | CAN 2.0, SCI, SPI, I2C |
| Temperatura de funcionamiento | — | -40C to +105C (industrial) |