MC68030FE25C vs MC68030FE20C Comparación
Comparación detallada lado a lado de MC68030FE25C por NXP Semiconductors y MC68030FE20C por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC68030FE25C - 25MHz 32-Bit MPU w/ MMU, 132-CQFP | NXP
MC68030FE25C ⚠ Última compraComparación de especificaciones
| Parámetro | MC68030FE25C | MC68030FE20C |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $57,40 | $92,00 |
| Core Architecture | M68000 (M680x0 CISC) | — |
| Ancho del bus de datos | 32-bit | 32-bit |
| Address Bus Width | 32-bit | 32-bit |
| Frecuencia de reloj máxima | 25 MHz | 20 MHz |
| Performance | approximately 7 MIPS at 25 MHz | — |
| On-chip Caches | 256-byte instruction cache + 256-byte data cache (configurable as unified) | — |
| Memory Management Unit (MMU) | Integrated, paged, supports 4 KB and 8 KB pages | — |
| Floating Point Support | External co-processor (MC68881 / MC68882) via co-processor interface | — |
| Burst Memory Mode | Yes (burst-fill for sequential accesses) | — |
| Operating Voltage | 5 V | 5 V +/- 5% |
| Encapsulado | 132-CQFP (24x24 mm, ceramic) | 132-pin CQFP (ceramic, windowed) |
| Temperature Grade | Commercial (0C to +70C) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Instruction Set Compatibility | User-mode binary compatible with MC68020; supports M680x0 line-A/line-F emulation | — |
| Estado RoHS | [DATA_NEEDED: RoHS status not in verified data] | [DATA_NEEDED: RoHS status] |
| Process Technology | HCMOS | HCMOS |
| Family | — | M68000 (68k) |
| Core | — | MC68030 (second-generation 32-bit) |
| Instruction Cache | — | 256 bytes |
| Data Cache | — | 256 bytes |
| MMU | — | Integrated, hardware paged |
| Package Dimensions | — | 24 x 24 mm |
| Power Dissipation | — | [DATA_NEEDED: typical power in W] |
| Temperatura de funcionamiento | — | [DATA_NEEDED: temperature range grade C] |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Bus Modes | — | Dynamic bus sizing (8/16/32-bit) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |