MC68332GVAG25557 vs MC68332GCAG25 Comparación
Comparación detallada lado a lado de MC68332GVAG25557 por NXP Semiconductors y MC68332GCAG25 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC68332GVAG25557 - 32-bit CPU32 MCU 25MHz LQFP-144 | NXP
MC68332GVAG25557 ✗ Fin de vidaNXP Semiconductors
MC68332GCAG25 - 32-Bit CPU32 MCU 25MHz TPU QSM | NXP
MC68332GCAG25 ⚠ Última compraComparación de especificaciones
| Parámetro | MC68332GVAG25557 | MC68332GCAG25 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $7,10 |
| Core Architecture | CPU32 (M68000-compatible 32-bit core) | — |
| Core Width | 32-bit | — |
| Frecuencia de reloj máxima | 25 MHz | 25 MHz |
| Program Memory Type | ROMless (external memory required) | ROMless (external memory required) |
| Internal RAM | 2 KB static RAM | — |
| Tensión de alimentación | 4.5 V to 5.5 V (5 V nominal) | — |
| Address Bus Width | 24-bit | — |
| External Data Bus Width | 16-bit | — |
| General-Purpose I/O Lines | 31 | — |
| Timing Coprocessor | Time Processor Unit (TPU) | — |
| Serial Module | QSM (queued SCI + QSPI) | — |
| Process Technology | HCMOS | — |
| Package Type | 144-terminal LQFP (LFQFP), square, 20x20 mm, gull-wing | — |
| JESD-30 Package Code | S-PQFP-G144 | — |
| Tipo de montaje | Surface Mount | Surface Mount (Gull Wing) |
| Terminal Form | Gull Wing | GULL WING |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Core | — | CPU32 (M68300 family) |
| Ancho del bus de datos | — | 32-bit |
| On-Chip RAM | — | 2 KB |
| Co-Processors | — | TPU (Time Processing Unit), QSM (Queued Serial Module) |
| Peripheral Modules | — | SIM, TPU, QSM via IMB bus |
| Número de pines | — | 144 |
| Encapsulado | — | LQFP-144 (20x20 mm) |
| Package Code (per JEDEC) | — | LFQFP |
| Height | — | 1.4 mm |
| Temperature Grade | — | INDUSTRIAL |
| Series | — | MC68332 |
| Architecture Family | — | M68300 / ColdFire predecessor |