MC7447AVS1000LB vs MPC7410VS500LE Comparación
Comparación detallada lado a lado de MC7447AVS1000LB por NXP Semiconductors y MPC7410VS500LE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC7410VS500LE - PowerPC G4 MPU, 500MHz, 360-FCCLGA | NXP
MPC7410VS500LE ⚠ Última compraComparación de especificaciones
| Parámetro | MC7447AVS1000LB | MPC7410VS500LE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $121,00 | $162,00 |
| Core Architecture | PowerPC G4 (MPC74xx) with AltiVec/VMX SIMD | — |
| Number of Cores | 1 | — |
| Ancho del bus de datos | 32-bit | 32-bit |
| Frecuencia de reloj máxima | 1.0 GHz | 500 MHz |
| L1 Instruction Cache | 64 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache (on-chip) | 512 KB unified | — |
| System Bus / MPX Bus | 200 MHz, up to 3.2 GB/s | — |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 2.5 V | — |
| Process Technology | 130 nm CMOS with copper interconnect | 0.13 µm CMOS |
| Encapsulado | 360-FCCLGA (25 x 25 mm) | 360-FCCLGA, 25 x 25 mm, flip-chip ceramic BGA |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Junction Temperature (Tj max) | 105 °C | — |
| Typical Power Dissipation | approximately 20 W at 1.0 GHz (Estimated: based on typical MPC74xx @ 1 GHz core voltage) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free / halogen-free] | — |
| Manufacturer | — | NXP USA Inc. (formerly Freescale, originally Motorola) |
| Product Type | — | 32-bit Embedded Microprocessor (MPU) |
| Series | — | MPC74xx (NITRO) |
| Core | — | PowerPC G4, 1 Core |
| Architecture | — | Power Architecture with AltiVec SIMD |
| Silicon Revision | — | R1.4 |
| Temperatura de funcionamiento | — | 0 °C to 105 °C (NITRO industrial) |
| Core / I/O Voltage | — | 1.8 V core / 2.5 V I/O (typical) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec 128-bit vector unit |
| FPU | — | Hardware double-precision floating-point |
| MMU | — | Yes (BookE-enhanced PowerPC) |
| System Bus | — | MPX high-bandwidth bus |
| Lead-Free (Pb-Free) | — | Yes (LE suffix) |
| Tipo de montaje | — | Surface Mount |