MC7447AVS1000LB vs MPC7410VS500LE Comparaison
Comparaison détaillée côte à côte de MC7447AVS1000LB par NXP Semiconductors et MPC7410VS500LE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC7410VS500LE - PowerPC G4 MPU, 500MHz, 360-FCCLGA | NXP
MPC7410VS500LE ⚠ Dernier achatComparaison des spécifications
| Paramètre | MC7447AVS1000LB | MPC7410VS500LE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $121,00 | $162,00 |
| Core Architecture | PowerPC G4 (MPC74xx) with AltiVec/VMX SIMD | — |
| Number of Cores | 1 | — |
| Largeur du bus de données | 32-bit | 32-bit |
| Fréquence d'horloge maximale | 1.0 GHz | 500 MHz |
| L1 Instruction Cache | 64 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache (on-chip) | 512 KB unified | — |
| System Bus / MPX Bus | 200 MHz, up to 3.2 GB/s | — |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 2.5 V | — |
| Process Technology | 130 nm CMOS with copper interconnect | 0.13 µm CMOS |
| Boîtier | 360-FCCLGA (25 x 25 mm) | 360-FCCLGA, 25 x 25 mm, flip-chip ceramic BGA |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Junction Temperature (Tj max) | 105 °C | — |
| Typical Power Dissipation | approximately 20 W at 1.0 GHz (Estimated: based on typical MPC74xx @ 1 GHz core voltage) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free / halogen-free] | — |
| Manufacturer | — | NXP USA Inc. (formerly Freescale, originally Motorola) |
| Product Type | — | 32-bit Embedded Microprocessor (MPU) |
| Series | — | MPC74xx (NITRO) |
| Core | — | PowerPC G4, 1 Core |
| Architecture | — | Power Architecture with AltiVec SIMD |
| Silicon Revision | — | R1.4 |
| Température de fonctionnement | — | 0 °C to 105 °C (NITRO industrial) |
| Core / I/O Voltage | — | 1.8 V core / 2.5 V I/O (typical) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec 128-bit vector unit |
| FPU | — | Hardware double-precision floating-point |
| MMU | — | Yes (BookE-enhanced PowerPC) |
| System Bus | — | MPX high-bandwidth bus |
| Lead-Free (Pb-Free) | — | Yes (LE suffix) |
| Type de montage | — | Surface Mount |