MC9RS08KA8CPJ vs MC9RS08LA8CLF Comparación
Comparación detallada lado a lado de MC9RS08KA8CPJ por NXP Semiconductors y MC9RS08LA8CLF por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9RS08KA8CPJ - 8-Bit RS08 MCU, 8KB Flash, 20-DIP | NXP
MC9RS08KA8CPJ ⚠ Última compraNXP Semiconductors
MC9RS08LA8CLF - 8KB Flash 8-Bit RS08 MCU w/ LCD | NXP
MC9RS08LA8CLF ⚠ Última compraComparación de especificaciones
| Parámetro | MC9RS08KA8CPJ | MC9RS08LA8CLF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,45 | $3,16 |
| Core Architecture | RS08 (HC08 instruction subset) | — |
| Ancho del bus de datos | 8 bit | — |
| Program Memory Size | 8 KB (8K x 8) FLASH | 8 KB (8K x 8) Flash |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Tensión de alimentación de funcionamiento | 2.5 V / 3.3 V / 5 V | — |
| Absolute Maximum Supply Voltage | 5.5 V | — |
| Rango de temperatura de funcionamiento | -40 °C to +85 °C | -40C to +85C |
| Encapsulado | 20-DIP (PDIP-20, 7.62 mm / 0.300 in) | — |
| Tipo de montaje | Through Hole | Surface Mount |
| Número de pines | 20 | — |
| I/O Supply Voltage | 1.8 V to 5.5 V | — |
| Oscillator Type | Internal | Internal |
| Flash Endurance | Typical 10k cycles [DATA_NEEDED: exact endurance from datasheet] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status from datasheet] | Compliant |
| Process Technology | CMOS [DATA_NEEDED: process node] | — |
| Core | — | RS08 (8-bit HC08 subset) |
| RAM Size | — | 256 B |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Number of I/O Lines | — | 31 |
| LCD Driver | — | Integrated segmented LCD with charge pump |
| Encapsulado / Carcasa | — | 48-LQFP (7x7) |
| Program Memory Type | — | Flash |
| Connectivity | — | I2C, SCI/SPI, GPIO |
| Peripherals | — | LCD driver, RTCC, ADC, TIM, KBI, BDM |
| Packaging | — | Tray |
| Nivel MSL | — | 3 |
| Series | — | RS08LA |
| Lifecycle | — | End of Life (Last Time Buy announced by NXP) |