MC9RS08KA8CTG vs MC9RS08KB8CTG Comparación
Comparación detallada lado a lado de MC9RS08KA8CTG por NXP Semiconductors y MC9RS08KB8CTG por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9RS08KA8CTG | MC9RS08KB8CTG |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,40 | $0,93 |
| Core Architecture | RS08 8-bit | — |
| Program Memory (Flash) | 8 KB (8K x 8) | — |
| RAM Size | 254 B | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Supply Voltage Range | 2.5 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/O Pins | 14 | [DATA_NEEDED: I/O pin count] |
| Encapsulado | 16-TSSOP (4.40 mm body width) | 16-TSSOP (0.173", 4.40 mm width) |
| Rango de temperatura de funcionamiento | -40 C to +85 C | -40C to +85C |
| Oscillator | Internal | — |
| ADC | Integrated (channels [DATA_NEEDED: number of ADC channels]) | — |
| Instruction Set | HC08 subset + BGND instructions | — |
| ICSP / Background Debug | Yes (BGND) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant (per distributor listings) |
| Nivel MSL | [DATA_NEEDED: msl level] | — |
| Core | — | RS08 (subset of HC08 with BGND) |
| Ancho del bus de datos | — | 8 bit |
| Program Memory Size | — | 8 KB (8K x 8) Flash |
| On-chip RAM | — | [DATA_NEEDED: RAM size] |
| On-chip EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Interrupt Structure | — | Single global interrupt vector |
| Debug Interface | — | RS08 background debug (BGND instruction) |
| Peripherals | — | ADC, Timers, Communication interfaces (per datasheet) |