MC9S08AC16MBE vs MC9S08DV16MLF Comparación
Comparación detallada lado a lado de MC9S08AC16MBE por NXP Semiconductors y MC9S08DV16MLF por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AC16MBE | MC9S08DV16MLF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,90 | $4,05 |
| Core | HCS08 (8-bit CISC) | — |
| CPU Clock Speed | 40 MHz (20 MHz internal bus) | — |
| Program Memory (Flash) | 16 KB (16K x 8) | — |
| RAM | 1 KB | — |
| Tensión de alimentación | 2.7 V to 5.5 V | — |
| I/O Pins | 38 | — |
| ADC | 10-bit, 8-channel | 16-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | 2x SCI (UART), 1x SPI, 1x I2C | — |
| Timers/PWM | 2x TPM (up to 6 channels) | — |
| Encapsulado | 42-pin SPDIP (DIP-42) | — |
| Tipo de montaje | Through-Hole (THT) | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (industrial) | — |
| On-chip Debug | Yes (BDC, single-wire) | — |
| Internal Clock Source | ICS with FLL (32 kHz reference) | — |
| Estado RoHS | Compliant (lead-free SPDIP) | — |
| Series | S08AC / Flexis | — |
| Core Processor | — | S08 |
| Core Size | — | 8-bit |
| Core Architecture | — | HCS08 / CISC |
| CPU Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 16 KB (16K x 8) FLASH |
| RAM Size | — | 1 KB (1K x 8) |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Number of I/O | — | 39 |
| Encapsulado / Carcasa | — | 48-LQFP (7x7 mm) |
| Connectivity | — | CANbus, I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Oscillator Type | — | External |
| Interrupt / Reset Sources | — | Up to 32 |
| Tensión de alimentación de funcionamiento | — | 3.3 V / 5 V |
| Temperature Grade | — | Automotive |
| Packaging | — | Tray |
| Instruction Set | — | HC08 (with BGND) |
| Compliance | — | RoHS compliant |