MC9S08AC60CFDE vs MC9S08AW60MFDE Comparación
Comparación detallada lado a lado de MC9S08AC60CFDE por NXP Semiconductors y MC9S08AW60MFDE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AC60CFDE | MC9S08AW60MFDE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,60 | $4,46 |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-bit | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Tensión de alimentación de funcionamiento | 3.3 V / 5 V | — |
| Number of I/O | 38 | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | Up to 16-channel with automatic compare function | — |
| Communication Interfaces | 2x SCI (LIN 2.0, SAE J2602), SPI, IIC | — |
| Peripherals | ADC, SCI, SPI, IIC | — |
| Encapsulado | 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad | 48-pin QFN-EP (7x7 mm, MO-220VKKD-2, 0.5 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Family Compatibility | Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) | — |
| Estado del ciclo de vida | NRND (per NXP product page) | — |
| Estado RoHS | ROHS COMPLIANT (per distributor datasheet listing) | Compliant |
| Packaging | Tray | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Core Architecture | — | HCS08 (8-bit CISC, enhanced HC08) |
| CPU Speed | — | 40 MHz (20 MHz internal bus) |
| Program Memory | — | 60 KB Flash |
| RAM | — | 2 KB |
| Tensión de alimentación | — | 2.7 V to 5.5 V |
| I/O Ports | — | 38 |
| Temperatura de funcionamiento | — | -40C to +85C (industrial) |
| ROM Type | — | Flash (in-application programmable) |
| Debug Interface | — | Single-wire BDM (background debug mode) |
| ADC | — | Up to 16-channel 10-bit |
| Timers | — | Multiple 16-bit timer/PWM channels |
| Communication | — | SCI (UART), SPI, I2C |